The TMUX6104 is a modern complementary metal-oxide semiconductor (CMOS) analog multiplexer (MUX) that offers 4:1 single-ended multiplexing. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or unsymmetric supplies (such as VDD = 12 V, VSS = –5 V). All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.
The TMUX6104 multiplexes one of four inputs (Sx) to a common output (D), depending on the status of the address pins (A0/ A1) and the enable pin (EN). Each switch conducts equally well in both directions in the ON position and supports input signal range up to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make (BBM) switching action.
The TMUX6104 device is part of Texas Instruments Precision Switches and Multiplexers family. The family of devices have very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 17 µA enables the device’s usage in portable applications.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX6104 36-V, Low-Capacitance, Low-Leakage-Current, Precision, 4:1 Analog Multiplexer datasheet (Rev. A) | PDF | HTML | 04 sep 2018 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 jun 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 dic 2021 | |
| Application brief | Improve Stability Issues with Low Con Multiplexers (Rev. A) | 10 dic 2018 | ||
| Technical article | Is charge injection causing output voltage errors in your industrial control syste | PDF | HTML | 18 oct 2018 | |
| Application note | System Level Protection for High Voltage Analog Multiplexers | 03 ene 2017 |
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The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| TSSOP (PW) | 14 | Ultra Librarian |
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