The TMUX6111, TMUX6112, and TMUX6113 devices are modern complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable single-pole/ single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±17 V), a single supply (10 V to 17 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.
The switches are turned on with Logic 0 on the digital control inputs in the TMUX6111. Logic 1 is required to turn on switches in the TMUX6112. The TMUX6113 has two switches with similar digital control logic to the TMUX6111 while the logic is inverted on the other two switches. The TMUX6113 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.
The TMUX611x devices are part of Texas Instruments Precision Switches and Multiplexers family. The devices have very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 17 µA enables the device usage in portable applications.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX611x ±17-V, Low-capacitance, Low-leakage-current, Precision, Quad SPST Switches datasheet (Rev. E) | PDF | HTML | 13 dic 2019 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 jun 2022 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 may 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 dic 2021 | |
| Application brief | Improve Stability Issues with Low Con Multiplexers (Rev. A) | 10 dic 2018 | ||
| Application note | System Level Protection for High Voltage Analog Multiplexers | 03 ene 2017 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RTE) | 16 | Ultra Librarian |
Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.
El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.
Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI.