Detalles del producto

Configuration 1:1 SPST Number of channels 2 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 120 CON (typ) (pF) 4.2 ON-state leakage current (max) (µA) 0.0004 Supply current (typ) (µA) 16 Bandwidth (MHz) 630 Operating temperature range (°C) -40 to 125 Features Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
Configuration 1:1 SPST Number of channels 2 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 120 CON (typ) (pF) 4.2 ON-state leakage current (max) (µA) 0.0004 Supply current (typ) (µA) 16 Bandwidth (MHz) 630 Operating temperature range (°C) -40 to 125 Features Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Wide supply range: ±5 V to ±16.5 V (dual) or 10 V to 16.5 V (single)
  • Latch-up performance meets 100 mA per JESD78 Class II Level A on all pins
  • Low on-capacitance: 4.2 pF
  • Low input leakage: 0.5 pA
  • Low charge injection: 0.51 pC
  • Rail-to-rail operation
  • Low on-resistance: 120 Ω
  • Fast switch turn-on time: 68 ns
  • Break-before-make switching (TMUX6123)
  • SELx pin connectable to VDD with integrated pull-down
  • Logic levels: 2 V to VDD
  • Low supply current: 16 µA
  • Human Body Model (HBM) ESD protection: ± 2 kV on all pins
  • Industry-standard VSSOP package
  • Wide supply range: ±5 V to ±16.5 V (dual) or 10 V to 16.5 V (single)
  • Latch-up performance meets 100 mA per JESD78 Class II Level A on all pins
  • Low on-capacitance: 4.2 pF
  • Low input leakage: 0.5 pA
  • Low charge injection: 0.51 pC
  • Rail-to-rail operation
  • Low on-resistance: 120 Ω
  • Fast switch turn-on time: 68 ns
  • Break-before-make switching (TMUX6123)
  • SELx pin connectable to VDD with integrated pull-down
  • Logic levels: 2 V to VDD
  • Low supply current: 16 µA
  • Human Body Model (HBM) ESD protection: ± 2 kV on all pins
  • Industry-standard VSSOP package

The TMUX6121, TMUX6122, and TMUX6123 are modern complementary metal-oxide semiconductor (CMOS) devices that have two independently selectable single-pole, single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.

The switches are turned on with Logic 1 on the digital control inputs in the TMUX6121. Logic 0 is required to turn on switches in the TMUX6122. The TMUX6123 has one switch with similar digital control logic to the TMUX6121 while the logic is inverted on the other switch. The TMUX6123 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.

The TMUX6121, TMUX6122, and TMUX6123 are part of the precision switches and multiplexers family of devices. The devices have very low leakage current and low charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 16 µA enables the device usage in portable applications.

The TMUX6121, TMUX6122, and TMUX6123 are modern complementary metal-oxide semiconductor (CMOS) devices that have two independently selectable single-pole, single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.

The switches are turned on with Logic 1 on the digital control inputs in the TMUX6121. Logic 0 is required to turn on switches in the TMUX6122. The TMUX6123 has one switch with similar digital control logic to the TMUX6121 while the logic is inverted on the other switch. The TMUX6123 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.

The TMUX6121, TMUX6122, and TMUX6123 are part of the precision switches and multiplexers family of devices. The devices have very low leakage current and low charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 16 µA enables the device usage in portable applications.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TMUX612x ±16.5-V, Low-Capacitance, Low-Leakage-Current, Precision, Dual SPST Switches datasheet (Rev. A) PDF | HTML 26 jul 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Guarding in Multiplexer Applications PDF | HTML 13 may 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Application note System Level Protection for High Voltage Analog Multiplexers 03 ene 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Modelo de simulación

TMUX6121 IBIS Model

SCDM206.ZIP (14 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VSSOP (DGS) 10 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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