The TMUX6121, TMUX6122, and TMUX6123 are modern complementary metal-oxide semiconductor (CMOS) devices that have two independently selectable single-pole, single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.
The switches are turned on with Logic 1 on the digital control inputs in the TMUX6121. Logic 0 is required to turn on switches in the TMUX6122. The TMUX6123 has one switch with similar digital control logic to the TMUX6121 while the logic is inverted on the other switch. The TMUX6123 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.
The TMUX6121, TMUX6122, and TMUX6123 are part of the precision switches and multiplexers family of devices. The devices have very low leakage current and low charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 16 µA enables the device usage in portable applications.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX612x ±16.5-V, Low-Capacitance, Low-Leakage-Current, Precision, Dual SPST Switches datasheet (Rev. A) | PDF | HTML | 26 jul 2022 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 jun 2022 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 may 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 dic 2021 | |
| Application note | System Level Protection for High Voltage Analog Multiplexers | 03 ene 2017 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| VSSOP (DGS) | 10 | Ultra Librarian |
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