Detalles del producto

Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 120 CON (typ) (pF) 5.5 ON-state leakage current (max) (µA) 0.0004 Supply current (typ) (µA) 17 Bandwidth (MHz) 670 Operating temperature range (°C) -40 to 125 Features Break-before-make, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 120 CON (typ) (pF) 5.5 ON-state leakage current (max) (µA) 0.0004 Supply current (typ) (µA) 17 Bandwidth (MHz) 670 Operating temperature range (°C) -40 to 125 Features Break-before-make, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Wide supply range: ±5 V to ±16.5 V (dual) or 10 V to 16.5 V (single)
  • Latch-up performance meets 100 mA per JESD78 Class II Level A on all pins
  • Low on-capacitance: 5.5 pF
  • Low input leakage: 0.5 pA
  • Low charge injection: –0.4 pC
  • Rail-to-rail operation
  • Low on-resistance: 120 Ω
  • Fast transition time: 66 ns
  • Break-before-make switching action
  • SELx pin connectable to VDD with integrated pull-down
  • Logic levels: 2 V to VDD
  • Low supply current: 17 µA
  • Human Body Model (HBM) ESD Protection: ± 2 kV on all pins
  • Industry-standard TSSOP package
  • Wide supply range: ±5 V to ±16.5 V (dual) or 10 V to 16.5 V (single)
  • Latch-up performance meets 100 mA per JESD78 Class II Level A on all pins
  • Low on-capacitance: 5.5 pF
  • Low input leakage: 0.5 pA
  • Low charge injection: –0.4 pC
  • Rail-to-rail operation
  • Low on-resistance: 120 Ω
  • Fast transition time: 66 ns
  • Break-before-make switching action
  • SELx pin connectable to VDD with integrated pull-down
  • Logic levels: 2 V to VDD
  • Low supply current: 17 µA
  • Human Body Model (HBM) ESD Protection: ± 2 kV on all pins
  • Industry-standard TSSOP package

The TMUX6136 is a complementary metal-oxide semiconductor (CMOS) analog switch containing two independently selectable SPDT switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. The digital select pin (SELx) has transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.

The TMUX6136 switches one of two inputs (Sx) to a common output (D), depending on the status of the SELx pins. Each switch conducts equally well in both directions in the ON position and supports input signal range up to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make (BBM) switching action.

The TMUX6136 is part of Texas Instruments precision switches and multiplexers family. The device has very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. The device also provides excellent isolation by blocking signal levels up to the supplies when the switches are in the OFF position. Low supply current of 17 µA enables usage in portable applications.

The TMUX6136 is a complementary metal-oxide semiconductor (CMOS) analog switch containing two independently selectable SPDT switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. The digital select pin (SELx) has transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.

The TMUX6136 switches one of two inputs (Sx) to a common output (D), depending on the status of the SELx pins. Each switch conducts equally well in both directions in the ON position and supports input signal range up to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make (BBM) switching action.

The TMUX6136 is part of Texas Instruments precision switches and multiplexers family. The device has very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. The device also provides excellent isolation by blocking signal levels up to the supplies when the switches are in the OFF position. Low supply current of 17 µA enables usage in portable applications.

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Documentación técnica

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* Data sheet TMUX6136 ±16.5-V, Low Capacitance, Low-Leakage-Current, Precision,Dual SPDT Switch datasheet (Rev. A) PDF | HTML 03 oct 2022
Application note How to Handle High Voltage Common Mode Applications using Multiplexers PDF | HTML 03 oct 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Application note Choosing the Right Multiplexer for MCU Expansion PDF | HTML 19 nov 2020
Application note System Level Protection for High Voltage Analog Multiplexers 03 ene 2017

Diseño y desarrollo

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Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Modelo de simulación

TMUX6136 IBIS Model

SCDM199.ZIP (14 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
TSSOP (PW) 16 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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