The TMUX6136 is a complementary metal-oxide semiconductor (CMOS) analog switch containing two independently selectable SPDT switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. The digital select pin (SELx) has transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.
The TMUX6136 switches one of two inputs (Sx) to a common output (D), depending on the status of the SELx pins. Each switch conducts equally well in both directions in the ON position and supports input signal range up to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make (BBM) switching action.
The TMUX6136 is part of Texas Instruments precision switches and multiplexers family. The device has very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. The device also provides excellent isolation by blocking signal levels up to the supplies when the switches are in the OFF position. Low supply current of 17 µA enables usage in portable applications.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX6136 ±16.5-V, Low Capacitance, Low-Leakage-Current, Precision,Dual SPDT Switch datasheet (Rev. A) | PDF | HTML | 03 oct 2022 |
| Application note | How to Handle High Voltage Common Mode Applications using Multiplexers | PDF | HTML | 03 oct 2022 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 jun 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 dic 2021 | |
| Application note | Choosing the Right Multiplexer for MCU Expansion | PDF | HTML | 19 nov 2020 | |
| Application note | System Level Protection for High Voltage Analog Multiplexers | 03 ene 2017 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
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