The TMUX7208 is a precision 8:1, single channel multiplexer while the TMUX7209 is a 4:1, 2 channel multiplexer featuring low on resistance and charge injection. The devices work with a single supply (4.5V to 44V), dual supplies (±4.5V to ±22V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The TMUX720x support bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.
The TMUX720x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. The TMUX720x family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX720x family of switches and multiplexers to be used in harsh environments.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX720x 44V, Latch-Up Immune, 8:1, 1-Channel and 4:1, 2-Channel Precision Multiplexers with 1.8V Logic datasheet (Rev. F) | PDF | HTML | 11 jul 2024 |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 may 2022 | |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 sep 2021 | ||
| Application brief | Precision Multiplexers Reducing Barriers in an Industrial Environment | PDF | HTML | 21 may 2021 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
El TMUXRUM-RRPEVM permite la rápida creación de prototipos y la caracterización de CC de la línea de productos TMUX de TI que utilizan encapsulados RUM o RRP (QFN) de 16 pines y está preparado para funcionar a alta tensión.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RUM) | 16 | Ultra Librarian |
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