The TMUX7212 is a complementary metal-oxide semiconductor (CMOS) switch with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. This device works with a single supply (4.5V to 44V), dual supplies (±4.5V to ±22V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The TMUX721x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.
The switches of the TMUX721x are controlled with appropriate logic control inputs on the SELx pins. The TMUX721x is part of the precision switches and multiplexers family of devices and has very low on and off leakage currents allowing them to be used in high precision measurement applications.
The TMUX721x provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX721x to be used in harsh environments.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX721x 44V , Low-RON, 1:1 (SPST), 4-Channel Precision Switches with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. D) | PDF | HTML | 10 jul 2024 |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 may 2022 | |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 20 sep 2021 | ||
| EVM User's guide | TMUX721xEVM Evaluation Module | 23 dic 2020 | ||
| Certificate | TMUX7211EVM EU RoHS Declaration of Conformity (DoC) (Rev. A) | 08 dic 2020 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
El TMUX721xEVM admite la evaluación de los dispositivos TMUX721x en el encapsulado TSSOP (PW) de 16 pines, incluidos TMUX7211PWR, TMUX7212PWR y TMUX7213PWR. Este módulo de evaluación puede utilizarse para la creación rápida de prototipos y pruebas de dispositivos TMUX721x, específicamente para (...)
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RUM) | 16 | Ultra Librarian |
Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.
El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.
Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI.