Detalles del producto

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 9.5 CON (typ) (pF) 20 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 300 Bandwidth (MHz) 500 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection Input/output continuous current (max) (mA) 10 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -44
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 9.5 CON (typ) (pF) 20 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 300 Bandwidth (MHz) 500 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection Input/output continuous current (max) (mA) 10 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -44
WQFN (RRP) 16 16 mm² 4 x 4
  • Wide supply voltage range:
    • Single supply: 8 V to 44 V
    • Dual supply: ±5 V to ±22 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Interrupt flags to indicate fault status
    • Output open circuited during fault
  • Latch-up immunity by device construction
  • Human Body Model (HBM) ESD rating: 6-kV
  • Low on-resistance: 8.3 Ω typical
  • Flat on-resistance: 10 mΩ typical
  • Logic capable: 1.8-V
  • Fail-safe logic: up to 44 V independent of supply
  • Industry-standard TSSOP and smaller WQFN packages
  • Wide supply voltage range:
    • Single supply: 8 V to 44 V
    • Dual supply: ±5 V to ±22 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Interrupt flags to indicate fault status
    • Output open circuited during fault
  • Latch-up immunity by device construction
  • Human Body Model (HBM) ESD rating: 6-kV
  • Low on-resistance: 8.3 Ω typical
  • Flat on-resistance: 10 mΩ typical
  • Logic capable: 1.8-V
  • Fail-safe logic: up to 44 V independent of supply
  • Industry-standard TSSOP and smaller WQFN packages

The TMUX7411F, TMUX7412F, and TMUX7413F are complementary metal-oxide semiconductor (CMOS) analog switches in 1:1 (SPST), 4-channel configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5  V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX741xF devices suitable for applications where power supply sequencing cannot be precisely controlled.

The devices block fault voltages up to +60 V or −60 V relative to ground in powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of the switch input conditions, and any control signal present on the logic pins is ignored. If the signal path input voltage on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. The drain pin (Dx) of a selected channel under a fault condition is floating. The TMUX741xF devices provide an active-low interrupt flag (FF) to indicate if any of the source inputs are experiencing a fault condition to help system diagnostics.

The TMUX7411F, TMUX7412F, and TMUX7413F are complementary metal-oxide semiconductor (CMOS) analog switches in 1:1 (SPST), 4-channel configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5  V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX741xF devices suitable for applications where power supply sequencing cannot be precisely controlled.

The devices block fault voltages up to +60 V or −60 V relative to ground in powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of the switch input conditions, and any control signal present on the logic pins is ignored. If the signal path input voltage on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. The drain pin (Dx) of a selected channel under a fault condition is floating. The TMUX741xF devices provide an active-low interrupt flag (FF) to indicate if any of the source inputs are experiencing a fault condition to help system diagnostics.

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Tipo Título Fecha
* Data sheet TMUX741xF ±60 V Fault-Protected, 1:1 (SPST), 4-Channel Switches With Latch-Up Immunity and 1.8-V Logic datasheet (Rev. B) PDF | HTML 01 nov 2022
Application brief How to Protect a Multi-Channel RTD System using Fault Protected Multiplexers (Rev. A) PDF | HTML 08 ago 2024
Application note Protecting and Maintaining Signal Integrity in PLC Systems (Rev. A) PDF | HTML 22 jul 2024
Application note Improving Analog Input Modules Reliability Using Fault Protected Multiplexers PDF | HTML 28 sep 2021

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

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El TMUX741-746EVM admite la evaluación de las familias de dispositivos TMUX741xF y TMUX746xF en encapsulados TSSOP (PW) y WQFN (RRP). Este módulo de evaluación (EVM) se puede utilizar para la creación rápida de prototipos y pruebas de las familias de dispositivos TMUX741xF y TMUX746xF para la (...)

Guía del usuario: PDF | HTML
Adaptador de interfaz

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The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Adaptador de interfaz

LEADLESS-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas de encapsulados sin plomo de 6, 8

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Guía del usuario: PDF
Modelo de simulación

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SCDM294.ZIP (31 KB) - IBIS Model
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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