Detalles del producto

Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C control Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 4.5 Supply current (typ) (µA) 8 Operating temperature range (°C) -40 to 85 Rating Catalog
Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C control Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 4.5 Supply current (typ) (µA) 8 Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFF) 16 3.24 mm² 1.8 x 1.8 WQFN (RTE) 16 9 mm² 3 x 3
  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)
  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

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Documentación técnica

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Tipo Título Fecha
* Data sheet Autonomous Audio Headset Switch datasheet (Rev. A) 29 may 2013
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) PDF | HTML 19 nov 2021
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch 04 mar 2016
Application note Preventing Excess Power Consumption on Analog Switches 03 jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Modelo de simulación

TS3A225E HSpice (LIN) Model

SCDM145.ZIP (483 KB) - HSpice Model
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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