Detalles del producto

Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Click/Pop noise reduction, FM Transmission Capability Supply voltage (min) (V) 2.6 Supply voltage (max) (V) 4.7 Supply current (typ) (µA) 6.5 Operating temperature range (°C) -40 to 85 Rating Catalog
Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Click/Pop noise reduction, FM Transmission Capability Supply voltage (min) (V) 2.6 Supply voltage (max) (V) 4.7 Supply current (typ) (µA) 6.5 Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFF) 9 1.96000000000000028000000000000001 mm² 1.4000000000000001 x 1.4000000000000001
  • Ground FET Switches (60mΩ typical)
  • Autonomous Detection of Headset Types:
    3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
  • Microphone Line Switches
  • Supports FM Signal Transmission Through the Ground FETs
  • Reduction of Click/Pop Noise
  • VDD Range: 2.6 V – 4.7 V
  • THD (Mic): 0.002% Typical
  • Low Current Consumption: 6.5-µA Typical
  • ±8kV Contract Discharge (IEC 61000-4-2) ESD Performance on SLEEVE and RING2 Pins
  • Ground FET Switches (60mΩ typical)
  • Autonomous Detection of Headset Types:
    3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
  • Microphone Line Switches
  • Supports FM Signal Transmission Through the Ground FETs
  • Reduction of Click/Pop Noise
  • VDD Range: 2.6 V – 4.7 V
  • THD (Mic): 0.002% Typical
  • Low Current Consumption: 6.5-µA Typical
  • ±8kV Contract Discharge (IEC 61000-4-2) ESD Performance on SLEEVE and RING2 Pins

The TS3A226AE is an audio headset switch that detects 3- or 4-pole 3.5mm accessories. For a 4-pole accessory with a microphone, the TS3A226AE also detects the MIC location and routes the microphone and ground signals automatically. The ground signal is routed through a pair of low-impedance ground FETs (60mΩ typical), resulting minimal impact on audio cross-talk performance. The autonomous detection feature allows end users to plug in accessories with different audio pole configurations into the mobile device and have them operate properly with no added software control and complexity. The ground FETs of the device are designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an FM antenna in mobile audio application.

The TS3A226AE is packaged within a 1.2mm × 1.2mm WCSP package, making it suitable for use in mobile application.

The TS3A226AE is an audio headset switch that detects 3- or 4-pole 3.5mm accessories. For a 4-pole accessory with a microphone, the TS3A226AE also detects the MIC location and routes the microphone and ground signals automatically. The ground signal is routed through a pair of low-impedance ground FETs (60mΩ typical), resulting minimal impact on audio cross-talk performance. The autonomous detection feature allows end users to plug in accessories with different audio pole configurations into the mobile device and have them operate properly with no added software control and complexity. The ground FETs of the device are designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an FM antenna in mobile audio application.

The TS3A226AE is packaged within a 1.2mm × 1.2mm WCSP package, making it suitable for use in mobile application.

Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 7
Tipo Título Fecha
* Data sheet AUTONOMOUS AUDIO HEADSET SWITCH, TS3A226AE datasheet (Rev. A) 24 jul 2013
Technical article USB Type-C™ power: Should your next device have USB Type-C? PDF | HTML 14 feb 2017
Technical article USB Type-C audio: Do I need to buy a new pair of headphones? PDF | HTML 07 jul 2016
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch 04 mar 2016
EVM User's guide TS3A226AE EVM Board User’s Guide (Rev. B) 13 ago 2013
Application note Preventing Excess Power Consumption on Analog Switches 03 jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TS3A226AEEVM — Módulo de evaluación TS3A226AE para interruptor autónomo de auriculares de audio

The TS3A226AEEVM is an evaluation module (EVM) for the Texas Instruments (TI) autonomous audio-headset switch. The EVM provides the basic functionality evaluation for theTS3A226AE device and provides peripheral connector for codec signal connection to MICP, TIP and RING1.

The TS3A226AE is an (...)

Guía del usuario: PDF
Modelo de simulación

TS3A226E HSPICE Model

SCDM156.ZIP (476 KB) - HSpice Model
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Diseños de referencia

TIDA-03030 — Diseño de referencia de protección de ruta de alimentación de USB tipo C™ con soporte de accesorios

The TIDA-03030 reference design provides a robust protection solution for the power path in USB Type-C™ applications. The design protects the power path from overvoltage, overcurrent, hot-plug, and reverse-current events by leveraging the TPS25923 (eFuse) and CSD17571Q2 (reverse-blocking (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-00006 — Interruptor de detección de auriculares para detectar los accesorios de 3.5 mm de 3 o 4 polos

This reference design is for autonomous audio headset switch applications. Some audio headsets have integrated analog microphones. The GND and MIC connections on the audio jack connector may be swapped depending on the manufacturer. This design has the ability to detect the presence of an analog (...)
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YFF) 9 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos