Detalles del producto

Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 0.2 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 350 COFF (typ) (pF) 70 CON (typ) (pF) 370 Off isolation (typ) (dB) -68 OFF-state leakage current (max) (µA) 0.375 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.15 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 0.2 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 350 COFF (typ) (pF) 70 CON (typ) (pF) 370 Off isolation (typ) (dB) -68 OFF-state leakage current (max) (µA) 0.375 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.15 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
DSBGA (YZP) 10 2.8125 mm² 2.25 x 1.25 VSON (DRC) 10 9 mm² 3 x 3 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Specified break-before-make switching
  • Negative signaling capability: maximum swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Low ON-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent ON-state resistance matching
  • 2.3-V to 5.5-V Power supply (VCC)
  • Latch-Up performance exceeds 100 mA Per JESD 78, Class II
  • ESD Performance tested per JESD 22
    • 2500-V Human-body model
      (A114-B, class II)
    • 1500-V Charged-device model (C101)
    • 200-V Machine model (A115-A)
  • Specified break-before-make switching
  • Negative signaling capability: maximum swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Low ON-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent ON-state resistance matching
  • 2.3-V to 5.5-V Power supply (VCC)
  • Latch-Up performance exceeds 100 mA Per JESD 78, Class II
  • ESD Performance tested per JESD 22
    • 2500-V Human-body model
      (A114-B, class II)
    • 1500-V Charged-device model (C101)
    • 200-V Machine model (A115-A)

The TS5A22362 is a bidirectional, 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00 mm × 3.00 mm DRC package is also available as a nonmagnetic package for medical imaging application.

The TS5A22362 is a bidirectional, 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00 mm × 3.00 mm DRC package is also available as a nonmagnetic package for medical imaging application.

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Documentación técnica

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* Data sheet TS5A22362 0.65-Ω 2-channel SPDT Analog Switches With Negative Signaling Capability datasheet (Rev. E) PDF | HTML 25 sep 2019
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 26 jul 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Application note Preventing Excess Power Consumption on Analog Switches 03 jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Adaptador de interfaz

LEADLESS-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas de encapsulados sin plomo de 6, 8

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Guía del usuario: PDF
Modelo de simulación

HSPICE Model for TS5A22362

SCDM121.ZIP (105 KB) - HSpice Model
Modelo de simulación

TS5A22362 IBIS Model

SCDM120.ZIP (68 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YZP) 10 Ultra Librarian
VSON (DRC) 10 Ultra Librarian
VSSOP (DGS) 10 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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