Detalles del producto

Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog, I2C, LVDS, UART Ron (typ) (Ω) 15 CON (typ) (pF) 17.5 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 0.01 Bandwidth (MHz) 220 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (mA) 50 TI functional safety category Functional Safety-Capable Rating Automotive Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog, I2C, LVDS, UART Ron (typ) (Ω) 15 CON (typ) (pF) 17.5 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 0.01 Bandwidth (MHz) 220 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (mA) 50 TI functional safety category Functional Safety-Capable Rating Automotive Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to 125°C
    • Device HBM ESD classification level H2
    • Device CDM ESD classification level C4B
  • Functional safety-capable
    • Documentation available to aid functional safety system design
  • Customer-specific configuration control can be supported along with major-change approval
  • Specified break-before-make switching
  • Low ON-state resistance (15 Ω)
  • Control inputs are 5-V tolerant
  • Low charge injection
  • Excellent ON-resistance matching
  • Low total harmonic distortion
  • 1.8-V to 5.5-V single-supply operation
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to 125°C
    • Device HBM ESD classification level H2
    • Device CDM ESD classification level C4B
  • Functional safety-capable
    • Documentation available to aid functional safety system design
  • Customer-specific configuration control can be supported along with major-change approval
  • Specified break-before-make switching
  • Low ON-state resistance (15 Ω)
  • Control inputs are 5-V tolerant
  • Low charge injection
  • Excellent ON-resistance matching
  • Low total harmonic distortion
  • 1.8-V to 5.5-V single-supply operation

The TS5A23157-Q1 is a dual, single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. The device can transmit signals up to 5.5 V (peak) in either direction.

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com.

The TS5A23157-Q1 is a dual, single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. The device can transmit signals up to 5.5 V (peak) in either direction.

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TS5A23157-Q1 Dual 15-Ω SPDT Analog Switch datasheet (Rev. B) PDF | HTML 17 jun 2021
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 30 abr 2024
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Functional safety information TS5A23157-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA PDF | HTML 29 mar 2021
More literature Automotive Logic Devices Brochure 27 ago 2014
Application note Preventing Excess Power Consumption on Analog Switches 03 jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Modelo de simulación

TS5A23157 IBIS Model

SCEM497.ZIP (92 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VSSOP (DGS) 10 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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