SN74LVTH16501

アクティブ

3.3 V ABT 18 ビット ユニバーサル・バス・トランシーバ、3 ステート出力

製品詳細

Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -6 Input type TTL-Compatible CMOS Output type 3-State Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Very high speed (tpd 5-10ns) Technology family LVT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -6 Input type TTL-Compatible CMOS Output type 3-State Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Very high speed (tpd 5-10ns) Technology family LVT Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • Members of the Texas Instruments
    Widebus™ Family
  • UBT™ Transceiver Combines D-Type
    Latches and D-Type Flip-Flops for
    Operation in Transparent, Latched, or
    Clocked Mode
  • State-of-the-Art Advanced BiCMOS
    Technology (ABT) Design for 3.3-V
    Operation and Low Static-Power
    Dissipation
  • Support Mixed-Mode Signal Operation (5-V
    Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation
    Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot
    Insertion
  • Bus Hold on Data Inputs Eliminates the
    Need for External Pullup/Pulldown
    Resistors
  • Distributed VCC and GND Pins Minimize
    High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

Widebus and UBT are trademarks of Texas Instruments.

  • Members of the Texas Instruments
    Widebus™ Family
  • UBT™ Transceiver Combines D-Type
    Latches and D-Type Flip-Flops for
    Operation in Transparent, Latched, or
    Clocked Mode
  • State-of-the-Art Advanced BiCMOS
    Technology (ABT) Design for 3.3-V
    Operation and Low Static-Power
    Dissipation
  • Support Mixed-Mode Signal Operation (5-V
    Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation
    Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot
    Insertion
  • Bus Hold on Data Inputs Eliminates the
    Need for External Pullup/Pulldown
    Resistors
  • Distributed VCC and GND Pins Minimize
    High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

Widebus and UBT are trademarks of Texas Instruments.

The ’LVTH16501 devices are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high and OEBA is active low).

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The ’LVTH16501 devices are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high and OEBA is active low).

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

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種類 タイトル 最新の英語版をダウンロード 日付
* データシート SN54LVTH16501, SN74LVTH16501 データシート (Rev. F) 2009年 8月 19日
アプリケーション・ノート Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
アプリケーション・ノート An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018年 9月 17日
セレクション・ガイド Logic Guide (Rev. AB) 2017年 6月 12日
アプリケーション・ノート Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
セレクション・ガイド ロジック・ガイド (Rev. AA 翻訳版) 最新英語版 (Rev.AB) 2014年 11月 6日
ユーザー・ガイド LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
アプリケーション・ノート Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
アプリケーション・ノート TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
アプリケーション・ノート 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002年 5月 22日
アプリケーション・ノート Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
セレクション・ガイド Advanced Bus Interface Logic Selection Guide 2001年 1月 9日
アプリケーション・ノート LVT-to-LVTH Conversion 1998年 12月 8日
アプリケーション・ノート LVT Family Characteristics (Rev. A) 1998年 3月 1日
アプリケーション・ノート Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
アプリケーション・ノート Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
アプリケーション・ノート Live Insertion 1996年 10月 1日
アプリケーション・ノート Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日

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シミュレーション・モデル

SN74LVTH16501 IBIS Model

SCEM173.ZIP (19 KB) - IBIS Model
パッケージ ピン数 CAD シンボル、フットプリント、および 3D モデル
SSOP (DL) 56 Ultra Librarian
TSSOP (DGG) 56 Ultra Librarian

購入と品質

記載されている情報:
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 使用原材料
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
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