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ロジックと電圧変換
構成可能なプログラマブル ロジック IC
プログラマブル ロジック アレイ (PLA)

TIBPAL16R6-20M

新規設計での使用を推奨しません

高性能 Impact PAL 回路

ご注文はこちら
データシート

TIBPAL16R6-20M

新規設計での使用を推奨しません
データシート ご注文はこちら

製品詳細

Rating Military Operating temperature range (°C) -55 to 125
Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • High-Performance Operation:
  • Propagation Delay
  • C Suffix...15 ns Max
  • M Suffix...20 ns Max
  • Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A
  • Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability
    DEVICE
    		I
    INPUTS
    		3-STATE
    O
    OUTPUTS
    		REGISTERED
    Q
    OUTPUTS
    		I/O
    PORTS
    PAL16L8
    		10
    		2
    		0
    		6
    PAL16R4
    		8
    		0
    		4 (3-state buffers)
    		4
    PAL16R6
    		8
    		0
    		6 (3-state buffers)
    		2
    PAL16R8
    		8
    		0
    		8 (3-state buffers)
    		0

    These devices are covered by U.S. Patent 4,410,987.
    IMPACT is a trademark of Texas Instruments.
    PAL is a registered trademark of Advanced Micro Devices Inc.
  • High-Performance Operation:
  • Propagation Delay
  • C Suffix...15 ns Max
  • M Suffix...20 ns Max
  • Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A
  • Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability
    DEVICE
    		I
    INPUTS
    		3-STATE
    O
    OUTPUTS
    		REGISTERED
    Q
    OUTPUTS
    		I/O
    PORTS
    PAL16L8
    		10
    		2
    		0
    		6
    PAL16R4
    		8
    		0
    		4 (3-state buffers)
    		4
    PAL16R6
    		8
    		0
    		6 (3-state buffers)
    		2
    PAL16R8
    		8
    		0
    		8 (3-state buffers)
    		0

    These devices are covered by U.S. Patent 4,410,987.
    IMPACT is a trademark of Texas Instruments.
    PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACTTM circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16' C series is characterized from 0°C to 75°C. The TIBPAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACTTM circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16' C series is characterized from 0°C to 75°C. The TIBPAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.
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技術資料

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種類 タイトル 最新の英語版をダウンロード 日付
* データシート High-Performance Impact Programmable Array Logic Circuits データシート (Rev. A) 2000年 4月 4日

購入と品質

記載されている情報：
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 使用原材料
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
記載されている情報：
  • ファブの拠点
  • 組み立てを実施した拠点