DRV8814
- 8 V to 45 V Operating Supply Voltage Range
- 2.5 A Maximum Drive Current at 24 V and TA = 25°C
- Dual H-Bridge Current-Control Motor Driver
- Drives Two DC Motors
- Four Level Winding Current Control
- Multiple Decay Modes
- Slow Decay
- Fast Decay
- Industry Standard Parallel Digital Control Interface
- Low Current Sleep Mode
- Built-In 3.3-V Reference Output
- Small Package and Footprint
- Protection Features
- Overcurrent Protection (OCP)
- Thermal Shutdown (TSD)
- VM Undervoltage Lockout (UVLO)
- Fault Condition Indication Pin (nFAULT)
The DRV8814 provides an integrated motor driver solution for printers, scanners, and other automated equipment applications. The device has two H-bridge drivers, and is intended to drive DC motors. The output driver block for each consists of N-channel power MOSFET’s configured as H-bridges to drive the motor windings. The DRV8814 can supply up to 2.5-A peak or 1.75-A RMS output current (with proper heatsinking at 24 V and 25°C) per H-bridge.
A simple parallel digital control interface is compatible with industry-standard devices. Decay mode is programmable to allow braking or coasting of the motor when disabled.
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage lockout, and over temperature.
The DRV8814 is available in a 28-pin HTSSOP package with PowerPAD™ (Eco-friendly: RoHS & no Sb/Br).
관심 가지실만한 유사 제품
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | DRV8814 DC Motor Driver IC datasheet (Rev. E) | PDF | HTML | 2015/11/30 |
Application note | Understanding Motor Driver Current Ratings (Rev. A) | PDF | HTML | 2024/07/05 | |
Application note | Best Practices for Board Layout of Motor Drivers (Rev. B) | PDF | HTML | 2021/10/14 | |
Application note | Calculating Power Dissipation for a H-Bridge or Half Bridge Driver (Rev. A) | PDF | HTML | 2021/07/22 | |
Application note | Methods to Configure Current Regulation for Brushed and Stepper Motors (Rev. B) | PDF | HTML | 2021/01/19 | |
Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018/07/06 | ||
User guide | DRV88xx EVM GUI (Rev. C) | 2017/04/27 | ||
Application brief | PowerPAD™ Made Easy (Rev. B) | 2004/05/12 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
HTSSOP (PWP) | 28 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.