TMUX8108
- High supply voltage capable:
- Dual supply: ±10 V to ±50 V
- Single supply: 10 V to 100 V
- Asymmetric dual supply operation
-
Consistent parametrics across supply voltages
- Latch-up immune
- Low crosstalk: –110 dB
- Low input leakage: 40 pA
- Low on resistance flatness: 0.5 Ω
- Removes need for additional logic rail (V L)
- 1.8 V Logic capable
- Fail-safe logic: up to 48 V independent of supply
- Integrated pull-down resistor on logic pins
- Bidirectional signal path
- Break-before-make switching
- Wide operating temperature T A: –40°C to 125°C
- Industry-standard TSSOP and smaller WQFN packages
The TMUX8108 and TMUX8109 are modern high voltage capable analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies, a single supply, or asymmetric supplies up to a maximum supply voltage of 100 V. The TMUX810x devices provide consistent analog parametric performance across the entire supply voltage range. The TMUX8108 and TMUX8109 support bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins.
All logic inputs support logic levels of 1.8 V, 3.3 V, 5 V and can be connected as high as 48 V, allowing for system flexibility with control signal voltage. Fail-safe logic circuitry allows voltages on the logic pins to be applied before the supply pin, protecting the device from potential damage.
The device family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows this family of multiplexers to be used in harsh environments.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX810x 100-V, Flat RON, Single 8:1 and Dual 4:1 Multiplexers with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. B) | PDF | HTML | 2023/08/03 |
| Application brief | Enabling Beyond the Supply & Overvoltage Tolerance Using High-Voltage Multiplexers in Data-Acquisition System | PDF | HTML | 2024/07/02 | |
| Application note | How to Handle High Voltage Common Mode Applications using Multiplexers | PDF | HTML | 2022/10/03 | |
| Product overview | PLC Analog Input Front-End Architectures | PDF | HTML | 2022/07/31 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 2022/05/13 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TMUX-24PW-EVM — 16, 20, 24핀 PW 얇은 수축 소형 아웃라인 패키지(TSSOP)용 TMUX 일반 평가 모듈
TMUX-24PW-EVM 평가 모듈을 사용하면 16, 20 또는 24핀 TSSOP 패키지(PW)를 사용하고 고전압 작동에 맞게 정격 조정된 TI의 TMUX 제품 라인의 빠른 프로토타이핑 및 DC 특성화가 가능합니다.
TMUXRUM-RRPEVM — 16핀 RUM 및 RRP QFN(Quad-Flatpack No-Lead) 패키지용 TMUX 일반 평가 모듈
TMUXRUM-RRPEVM을 사용하면 16핀 RUM 또는 RRP 패키지(QFN)를 사용하고 고전압 작동에 맞게 정격 조정된 TI의 TMUX 제품 라인의 빠른 프로토타이핑 및 DC 특성화가 가능합니다.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RUM) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.