TPS23754-1
- Powers up to 30-W (Input) PDs
- DC-DC Control Optimized for Isolated Converters
- Supports High-Efficiency Topologies
- Complete PoE Interface
- Enhanced Classification per IEEE 802.3at With Status Flag
- Adapter ORing Support
- Programmable Frequency With Synchronization
- Robust 100-V, 0.5-Ω Hotswap MOSFET
- –40°C to 125°C Junction Temperature Range
- Industry Standard PowerPAD™ HTSSOP-20
The TPS23754 and TPS23756 devices have a combined power-over-ethernet (PoE), powered-device (PD) interface, and current-mode DC-DC controller optimized specifically for isolated converters. The PoE interface supports the IEEE 802.3at standard.
The TPS23754 and TPS23756 support a number of input voltage ORing options including highest voltage, external adapter preference, and PoE preference. These features allow the designer to determine which power source will carry the load under all conditions.
The PoE interface features the new extended hardware classification necessary for compatibility with high-power midspan power sourcing equipment (PSE) per IEEE 802.3at. The detection signature pin can also be used to force power from the PoE source off. Classification can be programmed to any of the defined types with a single resistor.
The DC-DC controller features two complementary gate drivers with programmable dead time. This simplifies the design of active-clamp forward converters or optimized gate drive for highly-efficient flyback topologies. The second gate driver may be disabled if desired for single MOSFET topologies. The controller also features internal soft start, bootstrap start-up source, current-mode compensation, and a 78% maximum duty cycle. A programmable and synchronizable oscillator allows design optimization for efficiency and eases use of the controller to upgrade existing power supply designs. Accurate programmable blanking, with a default period, simplifies the usual current-sense filter design trade-offs.
The TPS23754 device has a 15-V converter start-up while the TPS23756 device has a 9-V converter start-up. The TPS23754-1 replaces the PPD pin with a no-connect for increased pin spacing.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TPS2375x IEEE 802.3at, High Efficiency, PoE Interface and DC-DC Controller datasheet (Rev. I) | PDF | HTML | 2017/12/19 |
Application note | PoE Powered Devices Debug Guidelines | PDF | HTML | 2021/07/19 | |
Application note | PoE PD Schematic Review Guidelines | PDF | HTML | 2021/04/29 | |
User guide | TPS23754EVM-383 EVM: Evaluation Module for TPS23754. (Rev. C) | 2011/11/28 | ||
Application note | Implementing a Buck Converter With the TPS23753A | 2010/09/20 | ||
Application note | Using the TPS23753A with an External Error Amplifier | 2010/08/06 | ||
User guide | TPS23754EVM-420 EVM: Evaluation Module for TPS | 2009/04/17 | ||
Application note | PoE Powered Device for 24 VAC Building Power Applications | 2008/09/10 | ||
Application note | Designing an EMI Compliant PoE with Isolated Flyback | 2008/05/20 | ||
Application note | Practical Guidelines EMI Compliant PoE | 2008/03/27 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TPS23754EVM-383 — TPS23754용 33-57V Vin, 12V Vout 고전력 평가 모듈
TPS23754EVM-383 contains evaluation and reference circuitry for the TPS23754, which is a Class 4 (25.5 W) PoE PD + PWM Controller. The TPS23754 is targeted at wide Vin aplications (24 V - 60 V) in isolated converter topologies and is compliant with the IEEE 802.3 at Power over Ethernet (PoE) (...)
TPS23754EVM-420 — TPS23754용 20-57V Vin, 5V Vout 고전력 평가 모듈
TPS23754EVM-420 contains evaluation and reference circuitry for the TPS23754, which is a Class 4 (25.5 W) PoE PD + PWM Controller. The TPS23754 is targeted at wide Vin aplications (24 V - 60 V) in isolated converter topologies and is compliant with the IEEE 802.3at Power over Ethernet (PoE) (...)
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
HTSSOP (PWP) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.