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SN74CB3Q3257

ACTIVE

3.3-V, 2:1 (SPDT), 4-channel general-purpose FET bus switch

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Data sheet

SN74CB3Q3257

ACTIVE
Data sheet Order now

Product details

Configuration 2:1 SPDT Number of channels 4 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 4 CON (typ) (pF) 10.5 Supply current (typ) (µA) 250 Bandwidth (MHz) 500 Operating temperature range (°C) -40 to 85 Features Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 64 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
Configuration 2:1 SPDT Number of channels 4 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 4 CON (typ) (pF) 10.5 Supply current (typ) (µA) 250 Bandwidth (MHz) 500 Operating temperature range (°C) -40 to 85 Features Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 64 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4 TVSOP (DGV) 16 23.04 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • High-bandwidth data path (up to 500MHz)
  • 5V Tolerant I/Os with device powered up or powered down
  • Low and flat on-state resistance (ron) characteristics over operating range (ron= 4Ω typical)
  • Rail-to-rail switching on data I/O ports
    • 0- to 5V Switching with 3.3V VCC
    • 0- to 3.3V Switching with 2.5V VCC
  • Bidirectional data flow with near-zero propagation delay
  • Low input and output capacitance minimizes loading and signal distortion (Cio(OFF) = 3.5pF typical)
  • Fast switching frequency (f OE = 20MHz maximum)
  • Data and control inputs provide undershoot clamp diodes
  • Low power consumption (ICC = 0.7mA typical)
  • VCC Operating range from 2.3V to 3.6V
  • Data I/Os support 0- to 5V signaling levels (0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5V)
  • Control inputs can be driven by TTL or 5V and 3.3V CMOS outputs
  • Ioff Supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA Per JESD 78, class II
  • ESD Performance tested per JESD 22
    • 2000V Human body model (A114-B, class II)
    • 1000V Charged-device model (C101)
  • Supports both digital and analog applications: USB interface, differential signal interface, bus isolation, low-distortion signal gating (1)

(1)For additional information regarding the performance characteristics of the CB3Q family, refer to the TI CBT-C, CB3T, and CB3Q Signal-Switch Families application report.
  • High-bandwidth data path (up to 500MHz)
  • 5V Tolerant I/Os with device powered up or powered down
  • Low and flat on-state resistance (ron) characteristics over operating range (ron= 4Ω typical)
  • Rail-to-rail switching on data I/O ports
    • 0- to 5V Switching with 3.3V VCC
    • 0- to 3.3V Switching with 2.5V VCC
  • Bidirectional data flow with near-zero propagation delay
  • Low input and output capacitance minimizes loading and signal distortion (Cio(OFF) = 3.5pF typical)
  • Fast switching frequency (f OE = 20MHz maximum)
  • Data and control inputs provide undershoot clamp diodes
  • Low power consumption (ICC = 0.7mA typical)
  • VCC Operating range from 2.3V to 3.6V
  • Data I/Os support 0- to 5V signaling levels (0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5V)
  • Control inputs can be driven by TTL or 5V and 3.3V CMOS outputs
  • Ioff Supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA Per JESD 78, class II
  • ESD Performance tested per JESD 22
    • 2000V Human body model (A114-B, class II)
    • 1000V Charged-device model (C101)
  • Supports both digital and analog applications: USB interface, differential signal interface, bus isolation, low-distortion signal gating (1)

(1)For additional information regarding the performance characteristics of the CB3Q family, refer to the TI CBT-C, CB3T, and CB3Q Signal-Switch Families application report.

The SN74CB3Q3257 device is a high-bandwidth FET bus switch using a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).

The SN74CB3Q3257 device is a high-bandwidth FET bus switch using a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).
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Technical documentation

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Type Title Date
* Data sheet SN74CB3Q3257 4-Bit 1-of-2 FET Multiplexer and Demultiplexer 2.5V and 3.3V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. E) PDF | HTML 06 Dec 2024
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) PDF | HTML 19 Nov 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Digital Bus Switch Selection Guide (Rev. A) 10 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Bus FET Switch Solutions for Live Insertion Applications 07 Feb 2003

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TAS2770EVM — TAS2770EVM Mono, Digital Input, Class-D, IV Sense Audio Amplifier Evaluation Module for QFN Package

The TAS2770EVM provides developers with a simple to use mono evaluation module that can be configured as a stereo solution and as a multi-channel solution. It is powerful tool kit for assessing stereo and mono implementations of the TAS2770 with or without IV sense. Everything needed for evaluating (...)
User guide: PDF
Not available on TI.com
Evaluation board

TAS2770EVM-STEREO — Stereo Evaluation Module of the TAS2770 Digital Input, Class-D, IV Sense Audio Amplifier

The TAS2770EVM-Stereo evaluation module provides developers with a simple to use module pre-configured in as a stereo solution. It is powerful tool kit for assessing stereo or mono implementations of the TAS2770 with or without IV sense. Everything needed for evaluating TAS2770 as a conventional (...)
User guide: PDF
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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

HSPICE Model of SN74CB3Q3257

SCDJ024.ZIP (28 KB) - HSpice Model
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Simulation model

SN74CB3Q3257 IBIS Model

SCDM049.ZIP (44 KB) - IBIS Model
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Reference designs

TIDA-01572 — Stereo Evaluation Module Reference Design of the Digital Input, Class-D, IV Sense Audio Amplifier

This reference design provides a high-performance stereo audio subsystem for use in PC applications. It operates off a single supply, ranging from 4.5 V to 16 V, and features the TAS2770, a digital-input Class-D audio amplifier that provides excellent noise and distortion performance and is (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
SSOP (DBQ) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian
TVSOP (DGV) 16 Ultra Librarian
VQFN (RGY) 16 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

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  • MSL rating/Peak reflow
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  • Ongoing reliability monitoring
Information included:
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  • Assembly location

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