BQ27000
- HDQ (bq27000) or I2C (bq27200) Communication
- Reports Accurate Time-to-Empty With Measured Load and Historical Maximum and Standby Loads
- Reports Temperature, Voltage, and Current
- High Accuracy Charge and Discharge Current Integration with Automatic Offset Calibration
- Requires No User Calibration
- Programmable Input/Output Port
- Internal User EEPROM Configuration Memory
- Automatic Capacity Reduction With Age
- Stable Oscillator Without External Components
- Dynamic End-of-Discharge Detection Delay to Allow Use in a High-Dynamic Load Environment
- Automatic Sleep Mode When Communication Lines are Low
- Available in a Small 3 mm x 4 mm QFN Package
- Five Low-Power Operating Modes
- Active: < 90 µA
- Sleep: < 2.5 µA
- Ship: < 2 µA (bq27000 only)
- Hibernate: < 1.5 µA
- Data Retention: < 20 nA
- APPLICATIONS
- PDA
- Smart Phones
- MP3 Players
- Digital Cameras
- Internet Appliances
- Handheld Devices
bqJUNIOR is a trademark of Texas Instruments.
The bqJUNIOR series are highly accurate stand-alone single-cell Li-Ion and Li-Pol battery capacity monitoring and reporting devices targeted at space-limited, portable applications. The IC monitors a voltage drop across a small current sense resistor connected in series with the battery to determine charge and discharge activity of the battery. Compensations for battery temperature, self-discharge, and discharge rate are applied to the capacity measurments to provide available time-to-empty information across a wide range of operating conditions. Battery capacity is automatically recalibrated, or learned, in the course of a discharge cycle from full to empty. Internal registers include current, capacity, time-to-empty, state-of-charge, cell temperature and voltage, status, and more.
The bqJUNIOR can operate directly from single-cell Li-Ion and Li-Pol batteries and communicates to the system over a HDQ one-wire or I2C serial interface.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Single-Cell Li-Ion and Li-Pol Battery Gas Gauge IC For Portable Applications datasheet (Rev. D) | 2006年 2月 27日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點