驅動程式或資料庫
BQ7973X-Q1-DESIGN — BQ7973x-Q1 design resources
BQ7973x-Q1 documentation repository
BQ79735-Q1
- AEC-Q100 qualified –40°C to +125°C
- Functional safety compliant
- Documentation to aid ISO 26262 system design
- Systematic capability up to ASIL D
- Hardware capability up to ASIL D
- 17 single-ended voltage channels
- High voltage pack, link, charge measurement accuracy update to 0.2%
- Pack and cell sync to 64uS
- 15 GPIO inputs as IO, I2C, SPI, ADC and temp sense
- Dedicated MOSFET switch drive pins
- Intelligent SPI contoller HUB
- Support multiple SPI peripheral devices
- HW pin to trigger contactor drivers and Pyro Fuse drivers
- Stackable and register map compatible with BQ7971x-Q1 cell monitors
The device can be used to measure divided down high voltage nodes in a battery system. It can measure voltage across Fuse, Contactors and check isolation voltage in battery junction box (BJB) system. There are 15 GPIOs/auxiliary inputs that can be used for HV measurements, thermistor measurements and driving relays. There are 4 SW outputs that can be used to drive MOSFET switches in the measurement path. The device can function as a SPI HUB and interface with up to 8 separate SPI devices/groups. The isolated bi-directional daisy chain ports support both capacitor and transformer based isolation. The device can also communicate with MCU over SPI and UART.
技術文件
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檢視所有 1 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | BQ79735-Q1 Pack Voltage and Isolation Resistance Monitor for HV Automotive BMS Applications datasheet | PDF | HTML | 2024年 10月 8日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
驅動程式或資料庫
BQ7973X-Q1-EVALUATION — BQ7973x-Q1 early evaluation files
BQ7973x-Q1 early evaluation files
支援產品和硬體
驅動程式或資料庫
BQ7973X-Q1-FMEDA — BQ7973x-Q1 FMEDA files
BQ7973x-Q1 FMEDA files
支援產品和硬體
驅動程式或資料庫
BQ7973X-Q1-FUNCTIONAL-SAFETY-DOCS — BQ7973x-Q1 functional safety documents
BQ7973x-Q1 functional safety documents
支援產品和硬體
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HTQFP (PHP) | 48 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。