產品詳細資料

Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 8 IOL (max) (mA) 7.8 IOH (max) (mA) -7.8 Input type CMOS Output type CMOS Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Technology family HC Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 8 IOL (max) (mA) 7.8 IOH (max) (mA) -7.8 Input type CMOS Output type CMOS Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Technology family HC Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 24 425.45 mm² 31.75 x 13.4
  • 2-V to 6-V VCC Operation (CD54HC646)
  • 4.5-V to 5.5-V VCC Operation (CD74HCT646)
  • Wide Operating Temperature Range of –55°C to 125°C
  • Balanced Propagation Delays and Transition Times
  • Standard Outputs Drive Up To 15 LS-TTL Loads
  • Significant Power Reduction Compared to LS-TTL Logic ICs
  • Inputs Are TTL-Voltage Compatible (CD74HCT646)
  • Independent Registers for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • True Data Paths

  • 2-V to 6-V VCC Operation (CD54HC646)
  • 4.5-V to 5.5-V VCC Operation (CD74HCT646)
  • Wide Operating Temperature Range of –55°C to 125°C
  • Balanced Propagation Delays and Transition Times
  • Standard Outputs Drive Up To 15 LS-TTL Loads
  • Significant Power Reduction Compared to LS-TTL Logic ICs
  • Inputs Are TTL-Voltage Compatible (CD74HCT646)
  • Independent Registers for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • True Data Paths

The CD54HC646 and CD74HCT646 consist of bus-transceiver circuits with 3-state outputs, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with these devices.

Output-enable (OE\) and direction-control (DIR) inputs control the transceiver functions. In the transceiver mode, data present at the high-impedance port can be stored in either or both registers.

The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. DIR determines which bus receives data when OE\ is active (low). In the isolation mode (OE\ high), A data can be stored in one register and/or B data can be stored in the other register.

When an output function is disabled, the input function still is enabled and can be used to store data. Only one of the two buses, A or B, can be driven at a time.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD54HC646 and CD74HCT646 consist of bus-transceiver circuits with 3-state outputs, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with these devices.

Output-enable (OE\) and direction-control (DIR) inputs control the transceiver functions. In the transceiver mode, data present at the high-impedance port can be stored in either or both registers.

The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. DIR determines which bus receives data when OE\ is active (low). In the isolation mode (OE\ high), A data can be stored in one register and/or B data can be stored in the other register.

When an output function is disabled, the input function still is enabled and can be used to store data. Only one of the two buses, A or B, can be driven at a time.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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類型 標題 日期
* Data sheet CD54HC646, CD74HCT646 datasheet (Rev. B) 2003年 4月 25日
* SMD CD54HC646 SMD 5962-86885 2016年 6月 21日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
User guide Signal Switch Data Book (Rev. A) 2003年 11月 14日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 1996年 5月 1日
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

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