ISO6731-Q1
- Functional Safety-Capable
- Documentation available to aid functional safety system design: ISO6731-Q1
- AEC-Q100 qualified with the following results:
- Device temperature Grade 1: –40°C to +125°C ambient operating temperature range
- Meets VDA320 isolation requirements
- 50 Mbps data rate
- Robust isolation barrier:
- High lifetime at 1500 VRMS working voltage
- Up to 5000 VRMS isolation rating
- Up to 10 kV surge capability
- ±75 kV/µs typical CMTI
- Wide supply range: 1.71 V to 1.89 V and 2.25 V to 5.5 V
- 1.71 V to 5.5 V level translation
- Default output high (ISO6731-Q1) and low (ISO6731F-Q1) options
- 1.6 mA per channel typical at 1 Mbps
- Low propagation delay: 11 ns typical
- Robust electromagnetic compatibility (EMC)
- System-level ESD, EFT, and surge immunity
- ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
- Low emissions
- Wide-SOIC (DW-16) Package
- Safety-Related Certifications:
- DIN VDE V 0884-11:2017-01
- UL 1577 component recognition program
- IEC 62368-1, IEC 61010-1, IEC 60601-1
- GB 4943.1-2011 certifications (pending)
The ISO6731-Q1 device is a high-performance, triple-channel digital isolators ideal for cost-sensitive applications requiring up to 5000 VRMS isolation ratings per UL 1577. This device is also certified by VDE, TUV, CSA, and CQC.
The ISO6731-Q1 devics provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications. The ISO6731-Q1 device has two forward and one reverse-direction channels. In the event of input power or signal loss, the default output is high for the device without suffix F and low for the device with suffix F. See Device Functional Modes section for further details.
Used in conjunction with isolated power supplies, this device helps prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO6731-Q1 device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO6731-Q1 device is available in a 16-pin SOIC wide-body (DW) package and is a pin-to-pin upgrade to the older generations.
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DIGI-ISO-EVM — 通用數位隔離器評估模組
DIGI-ISO-EVM 是一款評估模組 (EVM),可評估任何 TI 單通道、雙通道、三通道、四通道或六通道數位隔離器裝置,並提供五種不同封裝 - 8 接腳窄體 SOIC (D)、8 接腳寬體 SOIC (DWV)、16 接腳寬體 SOIC (DWW)、16 接腳超寬體 SOIC (DWW) 和 16 接腳 (DBQ) 封裝。EVM 具備足夠 Berg 接腳選項,可用於評估具最少外部零組件的裝置。
ISO6741DWEVM — ISO67xx 通用三通道或四通道數位隔離器評估模組
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。