ISO7330C
- Signaling Rate: 25 Mbps
- Integrated Noise Filter on the Inputs
- Default Output ‘High’ and ‘Low’ Options
- Low Power Consumption: Typical ICC per Channel
at 1 Mbps:- ISO7330: 1 mA (5 V Supplies),
0.8 mA (3.3 V Supplies) - ISO7331: 1.4 mA (5 V Supplies),
1 mA (3.3 V Supplies)
- ISO7330: 1 mA (5 V Supplies),
- Low Propagation Delay: 32 ns
Typical (5V Supplies) - Operates from 3.3 V and 5 V Supplies
- 3.3 V and 5 V Level Translation
- Wide Temperature Range: –40°C to 125°C
- 70 KV/µs Transient Immunity,
Typical (5V Supplies) - Robust Electromagnetic Compatibility (EMC)
- System-level ESD, EFT, and Surge Immunity
- Low Emissions
- Wide Body SOIC-16 Package
- Isolation Barrier Life: > 25 Years
- Safety and Regulatory Approvals:
- 4242 VPK Isolation per DIN V VDE V 0884-10
and DIN EN 61010-1 - 3000 VRMS Isolation for 1 minute per UL 1577
- CSA Component Acceptance Notice 5A, IEC
60950-1 and IEC 61010-1 End Equipment
Standards - CQC Certification per GB4943.1-2011
- 4242 VPK Isolation per DIN V VDE V 0884-10
ISO733x provide galvanic isolation up to 3000 VRMS for 1 minute per UL and 4242 VPK per VDE. These devices have three isolated channels comprised of logic input and output buffers separated by a silicon dioxide (SiO2) insulation barrier. ISO7330 has all three channels in the same direction while ISO7331 has two channels in forward and one channel in reverse direction. In case of input power or signal loss, default output is ‘low’ for devices with suffix ‘F’ and ‘high’ for devices without suffix ‘F’. Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. ISO733x has integrated noise filter for harsh industrial environment where short noise pulses may be present at the device input pins. ISO733x has TTL input thresholds and operates from 3 V to 5.5 V supply levels. Through innovative chip design and layout techniques, electromagnetic compatibility of ISO733x has been significantly enhanced to enable system-level ESD, EFT, Surge and Emissions compliance.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | ISO733x Robust EMC, Low Power, Triple-Channel Digital Isolators datasheet (Rev. B) | PDF | HTML | 2015年 4月 16日 |
| Certificate | VDE Certificate for Basic Isolation for DIN EN IEC 60747-17 (Rev. W) | 2024年 1月 31日 | ||
| White paper | Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. C) | PDF | HTML | 2023年 9月 7日 | |
| Certificate | CQC Certificate for ISOxxDWx (Rev. J) | 2023年 3月 27日 | ||
| Certificate | CSA Certificate for ISO73xxDW | 2023年 2月 22日 | ||
| Certificate | UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. P) | 2022年 8月 5日 | ||
| White paper | Why are Digital Isolators Certified to Meet Electrical Equipment Standards? | 2021年 11月 16日 | ||
| White paper | Distance Through Insulation: How Digital Isolators Meet Certification Requiremen | PDF | HTML | 2021年 6月 11日 | |
| EVM User's guide | Universal Digital Isolator Evaluation Module | PDF | HTML | 2021年 3月 4日 | |
| User guide | ISO73xx Triple/Quad Digital Isolator Evaluation Module | 2014年 9月 24日 |
設計與開發
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DIGI-ISO-EVM — 通用數位隔離器評估模組
DIGI-ISO-EVM 是一款評估模組 (EVM)，可評估任何 TI 單通道、雙通道、三通道、四通道或六通道數位隔離器裝置，並提供五種不同封裝 - 8 接腳窄體 SOIC (D)、8 接腳寬體 SOIC (DWV)、16 接腳寬體 SOIC (DWW)、16 接腳超寬體 SOIC (DWW) 和 16 接腳 (DBQ) 封裝。EVM 具備足夠 Berg 接腳選項，可用於評估具最少外部零組件的裝置。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (DW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點