SN54LS540
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- P-N-P Inputs Reduce D-C Loading
- Hysteresis at Inputs Improves Noise Margins
- Data Flow-thru Pinout (All Inputs on Opposite Side from Outputs)
These octal buffers and line drivers are designed to have the performance of the popular SN54LS240/SN74LS240 series and, at the same time, offer a pinout having the inputs and outputs on opposite sides of the package. This arrangement greatly enhances printed circuit board layout.
The three-state control gate is a 2-input NOR such that if either G1\ or G2\ are high, all eight outputs are in the high-impedance state.
The 'LS540 offers inverting data and the 'LS541 offers true data at the outputs.
The SN54LS540 and SN54LS541 are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LS540 and SN74LS541 are characterized for operation from 0°C to 70°C.
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檢視所有 11 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Octal Buffers And Line Drivers With 3-State Outputs datasheet | 1988年 3月 1日 | |
* | SMD | SN54LS540 SMD 8415501RA | 2016年 6月 21日 | |
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
Application note | Designing with the SN54/74LS123 (Rev. A) | 1997年 3月 1日 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||
Application note | Live Insertion | 1996年 10月 1日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CDIP (J) | 20 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點