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74ACT16245 現行 具有 3 態輸出的 16 位元匯流排收發器 Lower average drive strength (24mA)
SN74ALVCHR162245 現行 具有 3 態輸出的 16 位元匯流排收發器 Replacement
SN74LVCR162245 現行 具有 3 態輸出的 16 位元匯流排收發器 Replacement

產品詳細資料

Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -8 Input type TTL Output type TTL Features Bias Vcc, Bus-hold, Damping resistors, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Technology family ALVT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -8 Input type TTL Output type TTL Features Bias Vcc, Bus-hold, Damping resistors, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Technology family ALVT Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus™ Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive
    • A Port = –12/12 mA at 3.3-V VCC
    • B port = –32/64 mA at 3.3-V VCC
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • A-Port Outputs Have Equivalent 30- Series Resistors, So No External Resistors Are Required
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

Widebus is a trademark of Texas Instruments.

  • State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus™ Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive
    • A Port = –12/12 mA at 3.3-V VCC
    • B port = –32/64 mA at 3.3-V VCC
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • A-Port Outputs Have Equivalent 30- Series Resistors, So No External Resistors Are Required
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

Widebus is a trademark of Texas Instruments.

The ’ALVTH162245 devices are 16-bit (dual-octal) noninverting 3-state transceivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)\ input can be used to disable the device so that the buses are effectively isolated.

The A-port outputs, which are designed to source or sink up to 12 mA, include equivalent 30- series resistors to reduce overshoot and undershoot.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The ’ALVTH162245 devices are 16-bit (dual-octal) noninverting 3-state transceivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)\ input can be used to disable the device so that the buses are effectively isolated.

The A-port outputs, which are designed to source or sink up to 12 mA, include equivalent 30- series resistors to reduce overshoot and undershoot.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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類型 標題 日期
* Data sheet 2.5-V/3.3-V 16-Bit Bus Transceivers With 3-State Outputs datasheet (Rev. A) 2002年 4月 1日

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點