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SN74ALVTH16601

停產

具有 3 態輸出的 2.5-V/3.3-V 18 位元通用匯流排收發器

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產品規格表
SN74ALVTH16601 已停止生產
此產品已停產。新設計應考量替代產品。
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SN74ALVCH16601 現行 具有 3 態輸出的 18 位元通用匯流排收發器 Replacement

SN74ALVTH16601

停產
產品規格表 立即訂購

產品詳細資料

Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 24 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Technology family ALVT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 24 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Technology family ALVT Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TVSOP (DGV) 56 72.32 mm² 11.3 x 6.4
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, Clocked, or Clock-Enabled Mode
  • State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • High-Drive (-24/24 mA at 2.5-V and
    -32/64 mA at 3.3-V VCC)
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

NOTE: For tape and reel order entry:
The DGGR package is abbreviated to GR and
the DGVR package is abbreviated to VR.
UBT and Widebus are trademarks of Texas Instruments Incorporated.
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, Clocked, or Clock-Enabled Mode
  • State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • High-Drive (-24/24 mA at 2.5-V and
    -32/64 mA at 3.3-V VCC)
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

NOTE: For tape and reel order entry:
The DGGR package is abbreviated to GR and
the DGVR package is abbreviated to VR.
UBT and Widebus are trademarks of Texas Instruments Incorporated.

The 'ALVTH16601 devices are 18-bit universal bus transceivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.

Data flow in each direction is controlled by output-enable (OEAB\ and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. The clock can be controlled by the clock-enable (CLKENAB\ and CLKENBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. Output enable OEAB\ is active low. When OEAB\ is low, the outputs are active. When OEAB\ is high, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B, but uses OEBA\, LEBA, CLKBA, and CLKENBA\.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ALVTH16601 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16601 is characterized for operation from -40°C to 85°C.

The 'ALVTH16601 devices are 18-bit universal bus transceivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.

Data flow in each direction is controlled by output-enable (OEAB\ and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. The clock can be controlled by the clock-enable (CLKENAB\ and CLKENBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. Output enable OEAB\ is active low. When OEAB\ is low, the outputs are active. When OEAB\ is high, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B, but uses OEBA\, LEBA, CLKBA, and CLKENBA\.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ALVTH16601 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16601 is characterized for operation from -40°C to 85°C.
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類型 標題 日期
* Data sheet 2.5-V/3.3-V 18-Bit Universal Bus Transceiver With 3-State Outputs datasheet (Rev. A) 1999年 7月 12日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點