SN74GTLP21395

現行

具有獨立 LVTTL 埠、Fdbk 路徑和可選擇極性的雙路 1 位元 LVTTL/GTLP 可調整邊緣速率匯流排 Xcvrs

產品詳細資料

Technology family GTLP Applications GTL Rating Catalog Operating temperature range (°C) -40 to 85
Technology family GTLP Applications GTL Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes
  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • Split LVTTL Port Provides a Feedback Path for Control and Diagnostics Monitoring
  • Y Outputs Have Equivalent 26- Series Resistors, So No External Resistors Are Required
  • LVTTL Interfaces Are 5-V Tolerant
  • High-Drive GTLP Outputs (100 mA)
  • LVTTL Outputs (–12 mA/12 mA)
  • Variable Edge-Rate Control (ERC) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Polarity Control Selects True or Complementary Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC and TI-OPC are trademarks of Texas Instruments.

  • TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes
  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • Split LVTTL Port Provides a Feedback Path for Control and Diagnostics Monitoring
  • Y Outputs Have Equivalent 26- Series Resistors, So No External Resistors Are Required
  • LVTTL Interfaces Are 5-V Tolerant
  • High-Drive GTLP Outputs (100 mA)
  • LVTTL Outputs (–12 mA/12 mA)
  • Variable Edge-Rate Control (ERC) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Polarity Control Selects True or Complementary Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC and TI-OPC are trademarks of Texas Instruments.

The SN74GTLP21395 is two 1-bit, high-drive, 3-wire bus transceivers that provide LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation for applications, such as primary and secondary clocks, that require individual output-enable and true/complement controls. The device allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provide a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels and is designed especially to work with the Texas Instruments 3.3-V 1394 backplane physical-layer controller. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus settling time, and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes, with equivalent load impedance down to 11 .

The Y outputs, which are designed to sink up to 12 mA, include equivalent 26- resistors to reduce overshoot and undershoot.

GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP21395 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports, Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, and GTLP in BTL Applications, literature number SCEA017.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL or 5-V CMOS devices. VREF is the B-port differential input reference voltage.

This device is fully specified for live-insertion applications using Ioff , power-up 3-state, and BIAS VCC . The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.

High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLP21395 is two 1-bit, high-drive, 3-wire bus transceivers that provide LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation for applications, such as primary and secondary clocks, that require individual output-enable and true/complement controls. The device allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provide a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels and is designed especially to work with the Texas Instruments 3.3-V 1394 backplane physical-layer controller. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus settling time, and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes, with equivalent load impedance down to 11 .

The Y outputs, which are designed to sink up to 12 mA, include equivalent 26- resistors to reduce overshoot and undershoot.

GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP21395 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports, Texas Instruments GTLP Frequently Asked Questions, literature number SCEA019, and GTLP in BTL Applications, literature number SCEA017.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL or 5-V CMOS devices. VREF is the B-port differential input reference voltage.

This device is fully specified for live-insertion applications using Ioff , power-up 3-state, and BIAS VCC . The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.

High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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類型 標題 日期
* Data sheet Two 1-Bit LVTTL-to-GTLP Adjustable-Edge-Rate Bus Xcvrs w/ Split LVTTL Port, F/ba datasheet (Rev. C) 2005年 12月 1日
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024年 7月 12日
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024年 7月 3日
Selection guide Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
Application note Logic in Live-Insertion Applications With a Focus on GTLP 2002年 1月 14日
User guide GTLP/GTL Logic High-Performance Backplane Drivers Data Book (Rev. A) 2001年 9月 15日
Application note Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP) 2001年 4月 5日
Selection guide Advanced Bus Interface Logic Selection Guide 2001年 1月 9日
Application brief Texas Instruments GTLP Frequently Asked Questions 2001年 1月 1日
Application note Fast GTLP Backplanes With the GTLPH1655 (Rev. A) 2000年 9月 19日
More literature High Level Brochure of Gunning Transceiver Logic Plus 2000年 1月 14日

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使用指南: PDF | HTML
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模擬型號

HSPICE MODEL OF SN74GTLP21395

SCEJ176.ZIP (99 KB) - HSpice Model
模擬型號

SN74GTLP21395 IBIS Model

SCEM297.ZIP (34 KB) - IBIS Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SOIC (DW) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian

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