SN74LVT16501
- State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
- Members of the Texas Instruments WidebusTM Family
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
- Support Unregulated Battery Operation Down to 2.7 V
- UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
- Support Live Insertion
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- Flow-Through Architecture Optimizes PCB Layout
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
Widebus and UBT are trademarks of Texas Instruments Incorporated.
The 'LVT16501 are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
Data flow in each direction is controlled by output-enable (OEAB
and 
), latch-enable
(LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data
flow, the devices operate in the transparent mode when LEAB is high.
When LEAB is low, the A data is latched if CLKAB is held at a high or
low logic level. If LEAB is low, the A-bus data is stored in the
latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is
high, the outputs are active. When OEAB is low, the outputs are in
the high-impedance state.
Data flow for B to A is similar to that of A to B but uses , LEBA, and CLKBA. The output
enables are complementary (OEAB is active high and is active low).
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down,
should be tied
to VCC through a pullup resistor. The minimum value of the
resistor is determined by the current-sinking capability of the
driver. OE should be tied to GND through a pulldown resistor; the
minimum value of the resistor is determined by the current-sourcing
capability of the driver.
The SN74LVT16501 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the input/output (I/O) pin count and functionality of standard small-outline packages in the same printed circuit board area.
The SN54LVT16501 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT16501 is characterized for operation from -40°C to 85°C.
技術文件
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (DGG) | 56 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點