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SN74LVTH162241

現行

具有匯流排電位保持、TTL 相容 CMOS 輸入和 3 態輸出的 16 通道、2.7-V 至 3.6-V 緩衝器

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產品規格表

SN74LVTH162241

現行
產品規格表 立即訂購

產品詳細資料

Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 12 Supply current (max) (µA) 5000 IOH (max) (mA) -12 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 12 Supply current (max) (µA) 5000 IOH (max) (mA) -12 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • Members of the Texas Instruments Widebus™ Family
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
  • Output Ports Have Equivalent 22- Series Resistors, So No External Resistors Are Required
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus is a trademark of Texas Instruments.
  • Members of the Texas Instruments Widebus™ Family
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
  • Output Ports Have Equivalent 22- Series Resistors, So No External Resistors Are Required
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus is a trademark of Texas Instruments.

These 16-bit buffers/drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide noninverting outputs and complementary output-enable (OE and OE) inputs.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 22- series resistors to reduce overshoot and undershoot.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVTH162241 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTH162241 is characterized for operation from -40°C to 85°C.

These 16-bit buffers/drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide noninverting outputs and complementary output-enable (OE and OE) inputs.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 22- series resistors to reduce overshoot and undershoot.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVTH162241 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTH162241 is characterized for operation from -40°C to 85°C.
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類型 標題 日期
* Data sheet SN54LVTH162241, SN74LVTH162241 datasheet (Rev. E) 2006年 11月 1日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018年 9月 17日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002年 5月 22日
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
Selection guide Advanced Bus Interface Logic Selection Guide 2001年 1月 9日
Application note LVT-to-LVTH Conversion 1998年 12月 8日
Application note LVT Family Characteristics (Rev. A) 1998年 3月 1日
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日

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模擬型號

SN74LVTH162241 Behavioral SPICE Model

SCBM111.ZIP (7 KB) - PSpice Model
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模擬型號

SN74LVTH162241 IBIS Model

SCBM071.ZIP (21 KB) - IBIS Model
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian
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