產品詳細資料

Technology family TXB Applications SPI Bits (#) 6 Data rate (max) (Mbps) 100 High input voltage (min) (V) 0.78 High input voltage (max) (V) 5.5 Vout (min) (V) 1.2 Vout (max) (V) 5.5 IOH (max) (mA) -0.02 IOL (max) (mA) 0.02 Supply current (max) (µA) 18 Features Edge rate accelerator, Integrated pullup resistors, Output enable, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State, CMOS, Push-Pull Rating Automotive Operating temperature range (°C) -40 to 85
Technology family TXB Applications SPI Bits (#) 6 Data rate (max) (Mbps) 100 High input voltage (min) (V) 0.78 High input voltage (max) (V) 5.5 Vout (min) (V) 1.2 Vout (max) (V) 5.5 IOH (max) (mA) -0.02 IOL (max) (mA) 0.02 Supply current (max) (µA) 18 Features Edge rate accelerator, Integrated pullup resistors, Output enable, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State, CMOS, Push-Pull Rating Automotive Operating temperature range (°C) -40 to 85
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Qualified for Automotive Applications
  • 1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on
    B Port (VCCA ≤ VCCB)
  • VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Ioff Supports Partial-Power-Down Mode Operation
  • ESD Protection Exceeds AEC-Q100
    • A Port
      • 2000-V Human-Body Model
      • 1500-V Charged-Device Model
    • B Port
      • ±10-kV Human-Body Model
      • 1500-V Charged-Device Model
  • Qualified for Automotive Applications
  • 1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on
    B Port (VCCA ≤ VCCB)
  • VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Ioff Supports Partial-Power-Down Mode Operation
  • ESD Protection Exceeds AEC-Q100
    • A Port
      • 2000-V Human-Body Model
      • 1500-V Charged-Device Model
    • B Port
      • ±10-kV Human-Body Model
      • 1500-V Charged-Device Model

This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

The TXB0106-Q1 device is designed so that the OE input circuit is supplied by VCCA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

The TXB0106-Q1 device is designed so that the OE input circuit is supplied by VCCA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 9
類型 標題 日期
* Data sheet TXB0106-Q1 6-Bit Bidirectional Voltage-Level Translator With Auto-Direction Sensing and ±10-kV ESD Protection datasheet (Rev. A) PDF | HTML 2018年 4月 10日
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024年 7月 12日
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024年 7月 3日
Application note Leveraging Edge Rate Accelerators with Auto-Sensing Level Shifters PDF | HTML 2023年 9月 29日
Application note Do’s and Don’ts for TXB and TXS Voltage Level-Shifters with Edge Rate Accelerato PDF | HTML 2023年 6月 28日
Selection guide Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日
More literature Automotive Logic Devices Brochure 2014年 8月 27日
Application note A Guide to Voltage Translation With TXS-Type Translators 2010年 6月 29日
Application note A Guide to Voltage Translation With TXB-Type Translators 2010年 3月 3日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組

14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。

使用指南: PDF | HTML
TI.com 無法提供
開發板

DS90UB981-Q1EVM — DS90UB981-Q1 DSI 至 FPD-Link IV 橋接串聯器評估模組

DS90Ux981-Q1EVM 是用於評估 DS90Ux981-Q1 MIPI DS 至 FPD-Link IV 串聯器的評估模組 (EVM)。DS90Ux981-Q1 支援超高解析度,包括在 60Hz 下每像素 30 位元的 4K。2 個 MIPI DSI 連接埠輸出與 MIPI DSI v1.3.1 和 DPHY v1.2 相容,速度可達每通道 2.5Gbps,FPD-Link 介面在 FPD-Link IV 模式下支援每通道最高 10.8Gbps,或在 FPD-Link III 模式下支援每通道最高 3.675Gbps。DS90Ux981-Q1EVM 的 FPD-Link (...)
開發板

DS90UB981-Q1MEVM — DS90UB981-Q1 4K DSI 至 FPD-Link IV 橋接器串聯器評估模組

DS90Ux981-Q1MEVM 是用於評估 DS90Ux981-Q1 MIPI DSI 至 FPD-Link IV 串聯器的評估模組。DS90Ux981-Q1 支援超高解析度,包括在 60Hz 下每像素 30 位元的 4K。2 個 MIPI DSI 連接埠輸出與 MIPI DSI v1.3.1 和 DPHY v1.2 相容,速度可達每通道 2.5Gbps,FPD-Link 介面在 FPD-Link IV 模式下支援每通道最高 10.5Gbps,或在 FPD-Link III 模式下支援每通道最高 3.675Gbps。DS90Ux981-Q1MEVM 的 FPD-Link (...)
開發板

DS90UB983-Q1EVM — DS90UB983-Q1 DisplayPort 至 FPD-Link IV 橋接串聯器評估模組

DS90Ux983-Q1EVM 是用於評估 DS90Ux983-Q1 DisplayPort 至 FPD-Link IV 串聯器的評估模組。DS90Ux983-Q1 支援超高解析度,包括在 60Hz 下每像素 30 位元的 4K。DisplayPort 輸入與 DisplayPort v1.4 相容,速度可達每通道 8.1Gbps,而 FPD-Link 介面在 FPD-Link IV 模式下支援每通道最高 13.5Gbps,或在 FPD-Link III 模式下支援每通道最高 3.675Gbps。DS90Ux983-Q1EVM 的 FPD-Link 互連是一款車用 Rosenberger (...)

開發板

DS90UB983-Q1MEVM — DS90UB983-Q1 DisplayPort 至 FPD-Link IV 橋接串聯器評估模組

DS90Ux983-Q1MEVM 是用於評估 DS90Ux983-Q1 DisplayPort 至 FPD-Link IV 串聯器的評估模組。DS90Ux983-Q1 支援超高解析度,包括在 60Hz 下每像素 30 位元的 4K。DisplayPort 輸入與 DisplayPort v1.4 相容,速度可達每通道 8.1Gbps,而 FPD-Link 介面在 FPD-Link IV 模式下支援每通道最高 13.5Gbps,或在 FPD-Link III 模式下支援每通道最高 3.675Gbps。DS90Ux983-Q1MEVM 的 FPD-Link 互連為車用 12 路 Molex (...)

封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 16 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片