產品詳細資料

Technology family TXS Applications I2C, MDIO, SMbus Bits (#) 8 Data rate (max) (Mbps) 100 High input voltage (min) (V) 1 High input voltage (max) (V) 5.5 Vout (min) (V) 1.4 Vout (max) (V) 5.5 IOH (max) (mA) 0 IOL (max) (mA) 0 Supply current (max) (µA) 8 Features Edge rate accelerator, Output enable, Vcc isolation Input type Transmission Gate Output type 3-State, Transmission Gate Rating Catalog Operating temperature range (°C) -40 to 85
Technology family TXS Applications I2C, MDIO, SMbus Bits (#) 8 Data rate (max) (Mbps) 100 High input voltage (min) (V) 1 High input voltage (max) (V) 5.5 Vout (min) (V) 1.4 Vout (max) (V) 5.5 IOH (max) (mA) 0 IOL (max) (mA) 0 Supply current (max) (µA) 8 Features Edge rate accelerator, Output enable, Vcc isolation Input type Transmission Gate Output type 3-State, Transmission Gate Rating Catalog Operating temperature range (°C) -40 to 85
NFBGA (NME) 20 7.5 mm² 2.5 x 3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4 VQFN (RGY) 20 15.75 mm² 4.5 x 3.5
  • No direction-control signal needed
  • Maximum data rates:
    • 110Mbps (push pull)
    • 1.2Mbps (open drain)
  • 1.4V to 3.6V on A port and 1.65V to 5.5V on B port (VCCA ≤ VCCB)
  • No power-supply sequencing required – either VCCA or VCCB can be ramped first
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD protection exceeds JESD 22 (A port):
    • 2000 V Human Body Model (A114-B)
    • 150 V Machine Model (A115-A)
    • 1000 V Charged-Device Model (C101)

  • IEC 61000-4-2 ESD (B-port):
    • ± 8kV Contact Discharge
    • ± 6kV Air Discharge
  • No direction-control signal needed
  • Maximum data rates:
    • 110Mbps (push pull)
    • 1.2Mbps (open drain)
  • 1.4V to 3.6V on A port and 1.65V to 5.5V on B port (VCCA ≤ VCCB)
  • No power-supply sequencing required – either VCCA or VCCB can be ramped first
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD protection exceeds JESD 22 (A port):
    • 2000 V Human Body Model (A114-B)
    • 150 V Machine Model (A115-A)
    • 1000 V Charged-Device Model (C101)

  • IEC 61000-4-2 ESD (B-port):
    • ± 8kV Contact Discharge
    • ± 6kV Air Discharge

This device is an 8-bit non-inverting level translator which uses two separate configurable power-supply rails. The A port tracks the VCCA pin supply voltage. The VCCA pin accepts any supply voltage between 1.4V and 3.6V. The B port tracks the VCCB pin supply voltage. The VCCB pin accepts any supply voltage between 1.65V and 5.5V. Two input supply pins allows for low Voltage bidirectional translation between any of the 1.5V, 1.8V, 2.5V, 3.3V, and 5V voltage nodes.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance (Hi-Z) state.

To put the device in the Hi-Z state during power-up or power-down periods, tie OE to GND through a pull-down resistor. The current-sourcing capability of the driver determines the minimum value of the resistor.

This device is an 8-bit non-inverting level translator which uses two separate configurable power-supply rails. The A port tracks the VCCA pin supply voltage. The VCCA pin accepts any supply voltage between 1.4V and 3.6V. The B port tracks the VCCB pin supply voltage. The VCCB pin accepts any supply voltage between 1.65V and 5.5V. Two input supply pins allows for low Voltage bidirectional translation between any of the 1.5V, 1.8V, 2.5V, 3.3V, and 5V voltage nodes.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance (Hi-Z) state.

To put the device in the Hi-Z state during power-up or power-down periods, tie OE to GND through a pull-down resistor. The current-sourcing capability of the driver determines the minimum value of the resistor.

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技術文件

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類型 標題 日期
* Data sheet TXS0108E 8-Bit Bi-Directional, Level-Shifting, Voltage Translator for Open-Drain and Push-Pull Applications datasheet (Rev. L) PDF | HTML 2024年 11月 8日
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024年 7月 12日
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024年 7月 3日
Application brief Integrated vs. Discrete Open Drain Level Translation PDF | HTML 2024年 1月 9日
Application note Leveraging Edge Rate Accelerators with Auto-Sensing Level Shifters PDF | HTML 2023年 9月 29日
Application brief Future-Proofing Your Level Shifter Design with TI's Dual Footprint Packages PDF | HTML 2023年 9月 5日
Application note Do’s and Don’ts for TXB and TXS Voltage Level-Shifters with Edge Rate Accelerato PDF | HTML 2023年 6月 28日
Product overview Voltage Translation Application Quick Reference PDF | HTML 2022年 6月 28日
EVM User's guide TXS-EVM User's Guide (Rev. B) PDF | HTML 2021年 6月 8日
Selection guide Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日
Application note Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) 2018年 3月 28日
Application note A Guide to Voltage Translation With TXS-Type Translators 2010年 6月 29日

設計與開發

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開發板

14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組

14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。

使用指南: PDF | HTML
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開發板

14-24-NL-LOGIC-EVM — 適用於 14 針腳至 24 針腳無引線封裝的邏輯產品通用評估模組

14-24-NL-LOGIC-EVM 是一款靈活的評估模組 (EVM),設計用途可支援任何具有 14 針腳至 24 針腳 BQA、BQB、RGY、RSV、RJW 或 RHL 封裝的邏輯或轉換裝置。

使用指南: PDF | HTML
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開發板

TXS-EVM — 適用於單通道、雙通道、四通道和八通道裝置的轉換器系列評估模組

TXS-EVM 旨在支援單通道、雙通道、四通道和八通道 TXS 裝置。TXS 產品屬於自動雙向電壓位準轉換系列,運作電壓介於 1.2V 與 5.5 V,旨在支援不同產業中的各種通用電壓位準轉換應用。

使用指南: PDF | HTML
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模擬型號

TXS0108E IBIS Model (Rev. A)

SCEM547A.ZIP (167 KB) - IBIS Model
參考設計

TIDA-00352 — SDI 視訊聚合參考設計

This verified reference design is a complete four channel SDI aggregation and de-aggregation solution. One TLK10022 is used to aggregate four synchronous HD-SDI sources together into one 5.94 Gbps serial link. The serial data is transferred via copper or optical fiber where a second TLK10022 is (...)
Test report: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
NFBGA (NME) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian
VQFN (RGY) 20 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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