TXS02612
- 6-to-12 Demultiplexer/Multiplexer Allows SDIO Port Expansion
- Built-in Level Translator Eliminates Voltage Mismatch Between
Baseband and SD Card or SDIO Peripheral - VCCA, VCCB0, and VCCB1 Each Operate Over Full 1.1-V to 3.6-V Range
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance A Port
- 2000-V Human-Body Model (A114-B)
- 100-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
- ±8-kV Contact Discharge IEC 61000-4-2 ESD Performance (B Port)
MicroStar Junior is a trademark of Texas Instruments.
The TXS02612 is designed to interface the cell phone baseband with external SDIO peripherals. The device includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if required.
The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is selected; when SEL = High, B1 port is selected. SEL is referenced to VCCA. For the unselected B port, the clock output is held low, whereas the data and command I/Os are pulled high to their respective VCCB through a 70-k resistor (±30% tolerance).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TXS02612 SDIO Port Expander With Voltage-Level Translation datasheet (Rev. C) | 2010年 2月 3日 | |
Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024年 7月 12日 | |
Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024年 7月 3日 | |
Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021年 4月 15日 | ||
Application note | Translate Voltages for SDIO | PDF | HTML | 2020年 10月 20日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RTW) | 24 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點