SIMPLELINK-LOWPOWER-SDK

The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack, TI Wi-SUN FAN Stack, Amazon Sidewalk examples, as well as the TI-RTOS7 and FreeRTOS™ kernels and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU.

Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the following wireless solutions: Please refer to their respective repositories for resources and more information.

• The Matter standard: https://github.com/TexasInstruments/matter
• Thread 1.1.1 networking stack based on OpenThread: https://github.com/TexasInstruments/ot-ti

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.

This is version 8.30.01.01 of the SimpleLink Low Power F2 SDK. This version only contains internal metadata updates for integrating with the TI Developer Zone; there are no embedded software changes from the 8.30.00.121 release. This SDK is also available on GitHub at https://github.com/TexasInstruments/simplelink-lowpower-f2-sdk

The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx wireless MCU users by packaging essential software components, such as:

• Bluetooth® Low Energy (BLE) protocol stack

• Zigbee® protocol stack supporting low power wireless mesh networks

• Proprietary RF layer

• TI Drivers

All of the above are provided in one easy-to-use software package along with example applications and documentation.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.

This is version 8.40.02.01 of the SimpleLink Low Power F3 SDK.

Supported Features and Limitations

CC23xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported AES-ECB Supported AESECB_oneStepDecrypt, AESECB_setupDecrypt not supported AES-GCM Supported AES-CTR Supported AES-CBC Supported AESCBC_oneStepDecrypt, AESCBC_setupDecrypt not supported AES-CTR-DRBG Supported AES-CMAC Supported SHA-256 Supported ECDH Supported ECIES Supported RNG Supported TRNG Not Supported

CC27xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported LAES + HSM AES-ECB Supported LAES + HSM AES-GCM Supported LAES + HSM AES-CTR Supported LAES + HSM AES-CBC Supported LAES + HSM AES-CTR-DRBG Not Supported This is supported via RNG AES-CMAC Supported LAES + HSM ECDH Supported HSM ECDSA Supported HSM RNG Supported HSM (AES-CTR-DRBG) TRNG Supported HSM

LAES & HSM Limitations

The CC27xx family of devices now include a Hardware Security Module (HSM) for cryptographic and key storage features.

For crypto drivers that support the HSM and LAES, a failure in the HSM bootup process will be cached in the driver’s handle. If the user attempts to perform an HSM operation later, it will return an error due to the cached initialization error. LAES operations would continue to function without issue in that case.

For drivers that support running operations on both hardware accelerators, a switch has been implemented so that the driver knows which engine to use to execute the operation on. This switch is part of the cryptography operation’s key. The key encoding associated with each key that is included as part of the user-provided data to the driver is where the user can specify which hardware accelerator to use.

• To leverage the HSM hardware accelerator, the user has to call ‘CryptoKeyPlaintextHSM_initKey(..)’ API and pass in the plaintext key as well as the key length.

• To leverage the LAES hardware accelerator, the user has to call ‘CryptoKeyPlaintext_initKey()(..)’ API and pass in the plaintext key as well as the key length.

NOTE:

• Mass erasing the CC27xx without retaining protected sectors will result in the erasure of the HSM firmware. Please see the Quick Start Guide: Build your first program for the CC23xx or CC27xx device on how to re-flash the HSM firmware.