CC1314R10

ACTIVO

MCU inalámbrica SimpleLink™ Arm® Cortex®-M33 Sub-1 GHz con memoria flash de 1 MB y hasta 296 kB de S

Detalles del producto

Protocols 6LoWPAN, Amazon Sidewalk, IEEE 802.15.4, MIOTY, Proprietary, Wi-SUN, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 14 RAM (kByte) 296 Flash memory (kByte) 1024 CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 30, 46 Rating Catalog Operating temperature range (°C) -40 to 105
Protocols 6LoWPAN, Amazon Sidewalk, IEEE 802.15.4, MIOTY, Proprietary, Wi-SUN, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 14 RAM (kByte) 296 Flash memory (kByte) 1024 CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 30, 46 Rating Catalog Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RSK) 64 64 mm² 8 x 8

Wireless microcontroller

  • Powerful 48MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024kB flash program memory
  • 8kB of cache SRAM
  • 256kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32kB of additional SRAM if parity is disabled
  • Dynamic multiprotocol manager (DMM) driver
  • Supports over-the-air update (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4mA active mode, CoreMark
    • 71µA/MHz running CoreMark
    • 0.98µA standby mode, RTC, 256kB SRAM
    • 0.17µA shutdown mode, wake-up on pin
  • Ultra-low-power sensor controller consumption
    • 32µA in 2MHz mode
    • 849µA in 24MHz mode
  • Radio consumption:
    • 5.8mA RX at 868MHz
    • 25.8mA TX at +14dBm at 868MHz

Wireless protocol support

High-performance radio

  • -­121dBm for 2.5kbps long-range mode
  • -­110dBm at 50kbps, 802.15.4, 868MHz

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108 and STD-T67

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for a trusted execution environment
  • AES 128-bit and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40°C to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (30 GPIOs)
  • 8mm × 8mm RSK VQFN64 (46 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024kB flash program memory
  • 8kB of cache SRAM
  • 256kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32kB of additional SRAM if parity is disabled
  • Dynamic multiprotocol manager (DMM) driver
  • Supports over-the-air update (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4mA active mode, CoreMark
    • 71µA/MHz running CoreMark
    • 0.98µA standby mode, RTC, 256kB SRAM
    • 0.17µA shutdown mode, wake-up on pin
  • Ultra-low-power sensor controller consumption
    • 32µA in 2MHz mode
    • 849µA in 24MHz mode
  • Radio consumption:
    • 5.8mA RX at 868MHz
    • 25.8mA TX at +14dBm at 868MHz

Wireless protocol support

High-performance radio

  • -­121dBm for 2.5kbps long-range mode
  • -­110dBm at 50kbps, 802.15.4, 868MHz

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108 and STD-T67

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for a trusted execution environment
  • AES 128-bit and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40°C to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (30 GPIOs)
  • 8mm × 8mm RSK VQFN64 (46 GPIOs)
  • RoHS-compliant package

The SimpleLink™CC1314R10 device is a low-power, Sub-1GHz wireless microcontroller (MCU) targeting applications needing enhanced security, on-chip over-the-air update capability, and support for advanced applications or large wireless protocols. It supports IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), Wireless M-Bus, Wi-SUN, Amazon Sidewalk, mioty , and proprietary systems, including the TI 15.4-Stack (Sub-1GHz). The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, gateways and grid communications, home theater and entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID, and trusted functions support.
  • Flexible Sub-1 GHz radio supporting industry standard frequency bands (315MHz, 433MHz, 868MHz, 915MHz, and more) to meet industrial needs.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK) including Wi-SUN, Amazon Sidewalk, and SimpleLink™ 15.4-Stack (Sub-1GHz).
  • Maximum transmit power of +14dBm at Sub-1GHz with 25.8mA current consumption.
  • Longer battery life wireless applications with a low standby current of 0.98µA and full SRAM retention.
  • Industrial temperature ready with lowest standby current of approximately 13µA at 105⁰C (with full SRAM retention).
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1Hz ADC sampling at 1.2µA system current.
  • Low Soft Error Rate (SER) Failure-in-time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (–121dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1314R10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more details, see the SimpleLink MCU platform.

In addition to the software compatibility, within the Sub-1GHz wireless MCUs, there is pin-to-pin compatibility from 32kB of flash up to 1MB of flash in the 7mm × 7mm QFN package for maximum design scalability. For more information on TI’s Sub-1GHz devices, see www.ti.com/sub1ghz.

The SimpleLink™CC1314R10 device is a low-power, Sub-1GHz wireless microcontroller (MCU) targeting applications needing enhanced security, on-chip over-the-air update capability, and support for advanced applications or large wireless protocols. It supports IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), Wireless M-Bus, Wi-SUN, Amazon Sidewalk, mioty , and proprietary systems, including the TI 15.4-Stack (Sub-1GHz). The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, gateways and grid communications, home theater and entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID, and trusted functions support.
  • Flexible Sub-1 GHz radio supporting industry standard frequency bands (315MHz, 433MHz, 868MHz, 915MHz, and more) to meet industrial needs.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK) including Wi-SUN, Amazon Sidewalk, and SimpleLink™ 15.4-Stack (Sub-1GHz).
  • Maximum transmit power of +14dBm at Sub-1GHz with 25.8mA current consumption.
  • Longer battery life wireless applications with a low standby current of 0.98µA and full SRAM retention.
  • Industrial temperature ready with lowest standby current of approximately 13µA at 105⁰C (with full SRAM retention).
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1Hz ADC sampling at 1.2µA system current.
  • Low Soft Error Rate (SER) Failure-in-time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software-controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (–121dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1314R10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more details, see the SimpleLink MCU platform.

In addition to the software compatibility, within the Sub-1GHz wireless MCUs, there is pin-to-pin compatibility from 32kB of flash up to 1MB of flash in the 7mm × 7mm QFN package for maximum design scalability. For more information on TI’s Sub-1GHz devices, see www.ti.com/sub1ghz.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet CC1314R10 SimpleLink™ High-Performance Sub-1 GHz Wireless MCU datasheet (Rev. B) 30 abr 2024
* Errata CC1314R10 SimpleLink™ Wireless MCU Device Revision C (Rev. B) 21 nov 2024
* User guide CC13x4, CC26x4 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 23 mar 2023
Application note TI Wi-SUN® Network Performance PDF | HTML 01 ago 2025
Product overview TI Wi-SUN® FAN Stack - Software Overview (Rev. B) PDF | HTML 09 jun 2025
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 ago 2024
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 02 may 2024
User guide SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 02 may 2024
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 09 abr 2024
Application note TI 15.4-Stack Software PDF | HTML 17 oct 2023
Application brief Wireless MCUs Designed to Meet Complex IoT Requirements PDF | HTML 12 jul 2023
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 mar 2022
Application note 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 07 feb 2022
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20 dic 2021
Technical article 4 questions to ask before choosing a Wi-SUN stack PDF | HTML 13 ago 2021
More literature Webinar: Wireless mesh networking 04 mar 2021
Technical article How Wi-SUN® FAN improves connected infrastructures PDF | HTML 19 nov 2020
Technical article How TI helps expand connectivity beyond the front door with Amazon Sidewalk PDF | HTML 21 sep 2020
Application note Finding Settings for New Phy’s for the CC13x0 and CC13x2 Family PDF | HTML 14 sep 2020
Application note CC13xx IQ Samples (Rev. B) PDF | HTML 24 ago 2020
Application note Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 31 mar 2020
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 28 ene 2020
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 27 ene 2020
White paper Simple and efficient software development with the SimpleLink™ MCU platform (Rev. E) 06 dic 2019
White paper Deep dive into the tools and development kits of the SimpleLink™ MCU platform (Rev. B) 25 sep 2019
Technical article Designing a building security system with the Sub-1 GHz Linux Gateway Software Dev PDF | HTML 25 sep 2019
More literature Understanding security features for SimpleLink™ Sub-1 GHz CC13x2 MCUs 17 jun 2019
Application note Debugging Communication Range (Rev. A) PDF | HTML 23 may 2019
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 15 abr 2019
Product overview Out-of-box star-network solution: TI 15.4-Stack 14 ene 2019
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 10 ene 2019
Application note RF PCB Simulation Cookbook 09 ene 2019
Product overview Meet the SimpleLink™ Sensor Controller 04 ene 2019
Product overview Time Multiplexing: Concurrent Multi-standard Operation 03 ene 2019
White paper Migrating your proprietary solution to the SimpleLink™ WMCU 07 nov 2018
Product overview Electronic Smart Locks: Ultra-low power and Multi-Standard operation 05 nov 2018
Technical article Unlock every door with the SimpleLink™ platform PDF | HTML 19 sep 2018
Application note Low-Power ADC Solution for CC13x2 and CC26x2 02 mar 2018
Application brief Single-Chip Flow Metering Solution With the CC13x2R Wireless MCUs 27 feb 2018
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 27 feb 2018
Application note Hardware Migration From CC1310 to CC1312R 17 oct 2017
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 05 mar 2017
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 feb 2017
User guide TI-RTOS 2.20 for CC13xx/CC26xx SimpleLink Getting Started Guide (Rev. D) 17 jun 2016

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Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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Para comenzar a evaluar el software de protocolo MIOTY® con el kit LaunchPad SensorTag:
  1. compre uno o más kits SensorTag CC1352R
  2. compre un kit de desarrollo LaunchPad CC1352R1
  3. descargue el kit de desarrollo de software SimpleLink™
  4. Para el desarrollo de pilas MIOTY, póngase en contacto con Stackforce
  5. (...)
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Símbolo CAD/CAE

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SPRR435.ZIP (4358 KB)
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Diseños de referencia

TIDEP0084 — Diseño de referencia de puerta de enlace IoT industrial del sensor a la nube menor a 1 GHz para sist

Este diseño de referencia demuestra cómo conectar sensores a la nube a través de una red inalámbrica inferior a 1 GHz de largo alcance, adecuada para entornos industriales como el control de edificios y el seguimiento de activos.

El diseño se basa en una puerta de enlace Linux®.  También hay (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-010032 — Diseño de referencia de concentrador de datos universal compatible con Ethernet, malla RF 6LoWPAN

Las comunicaciones de red basadas en IPv6 se están convirtiendo en la opción estándar en mercados y aplicaciones industriales como los contadores inteligentes y la automatización de la red eléctrica. El diseño del concentrador de datos universal proporciona una solución de red completa basada en (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-010024 — Diseño de referencia de nodo final de malla 6LoWPAN protegido con diseño de referencia de capacidad

Este diseño de referencia implementa un nodo final de red de malla de radiofrecuencia (RF) con seguridad DTLS para redes de Infraestructura de Medición Avanzada (AMI) de medidores inteligentes. La red es una solución IPv6 sobre redes inalámbricas de área personal de baja potencia (6LoWPAN). El (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDC-01002 — Diseño de referencia de puerta de enlace del sensor a la nube SimpleLink™ menor a 1 GHz para sistema

El diseño de referencia del sensor a la nube SimpleLink™ inferior a 1 GHz demuestra cómo conectar sensores a la nube a través de una red inalámbrica inferior a 1 GHz de largo alcance, adecuada para entornos industriales como el control de edificios y el seguimiento de activos.

La solución se basa en (...)
Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RGZ) 48 Ultra Librarian
VQFN (RSK) 64 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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