CC1190
RF frontal 850-950 MHz
CC1190
- Seamless Interface to Sub-1 GHz Low Power RF Devices from Texas Instruments
- Up to 27 dBm (0.5 W) Output Power
- 6 dB Typical Sensitivity Improvement with CC11xx and CC430
- Few External Components
- Integrated PA
- Integrated LNA
- Integrated Switches
- Integrated Matching Network
- Integrated Inductors
- Digital Control of LNA and PA Gain by HGM Pin
- 50-nA in Power Down (LNA_EN = PA_EN = 0)
- High Transmit Power Efficiency
- PAE = 50% at 26 dBm Output Power
- Low Receive Current Consumption
- 3 mA for High Gain Mode
- 26 µA for Low Gain Mode
- 2.9 dB LNA Noise Figure, Including Switch and External Antenna Match
- RoHS Compliant 4-mm × 4-mm QFN-16 Package
- 2 V to 3.7 V Operation
- APPLICATIONS
- 850 - 950 MHz ISM Bands Wireless Systems
- Wireless Sensor Networks
- Wireless Industrial Systems
- IEEE 802.15.4 Systems
- Wireless Consumer Systems
- Wireless Metering (AMR/AMI) Systems
- Smart Grid Wireless Networks
CC1190 is a cost-effective and high-performance RF Front End for low-power and low-voltage wireless applications at 850 - 950 MHz.
CC1190 is a range extender for the sub-1 GHz low-power RF transceivers, transmitters, and System-on-Chip devices from Texas Instruments.
CC1190 integrates a power amplifier (PA), a low-noise amplifier (LNA), switches, and RF matching for the design of a high-performance wireless systems.
CC1190 increases the link budget by providing a power amplifier for increased output power, and an LNA with low noise figure for improved receiver sensitivity.
CC1190 provides an efficient and easy-to-use range extender in a compact 4-mm × 4-mm QFN-16 package.
Documentación técnica
Diseño y desarrollo
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
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Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
---|---|---|
VQFN (RGV) | 16 | Ultra Librarian |
Pedidos y calidad
- RoHS
- REACH
- Marcado del dispositivo
- Acabado de plomo/material de la bola
- Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
- Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
- Contenido del material
- Resumen de calificaciones
- Monitoreo continuo de confiabilidad
- Lugar de fabricación
- Lugar de ensamblaje
Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.
Soporte y capacitación
Foros de TI E2E™ con asistencia técnica de los ingenieros de TI
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