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Microcontroladores MSP430

MSP430FR68891

ACTIVO

MCU de detección rotativa con interfaz de escaneo ampliado, 128 KB FRAM, LCD, cargador de arranque I

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MSP430FR68891

ACTIVO
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Detalles del producto

Frequency (MHz) 16 Nonvolatile memory (kByte) 128 RAM (kByte) 2 ADC type 12-bit SAR Number of ADC channels 16 Number of GPIOs 83 Features Advanced sensing, DMA, LCD, Real-time clock, Scan interface UART 2 USB No Number of I2Cs 2 SPI 4 Number of comparator channels 16 Timers - 16-bit 5 Bootloader (BSL) I2C Operating temperature range (°C) -40 to 85 Rating Catalog
Frequency (MHz) 16 Nonvolatile memory (kByte) 128 RAM (kByte) 2 ADC type 12-bit SAR Number of ADC channels 16 Number of GPIOs 83 Features Advanced sensing, DMA, LCD, Real-time clock, Scan interface UART 2 USB No Number of I2Cs 2 SPI 4 Number of comparator channels 16 Timers - 16-bit 5 Bootloader (BSL) I2C Operating temperature range (°C) -40 to 85 Rating Catalog
LQFP (PN) 80 196 mm² 14 x 14 LQFP (PZ) 100 256 mm² 16 x 16
  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 16-MHz Clock
    • Wide Supply Voltage Range From 3.6 V Down to 1.8 V (Minimum Supply Voltage is Restricted by SVS Levels, See the SVS Specifications)
  • Optimized Ultra-Low-Power Modes
    • Active Mode: Approximately 100 µA/MHz
    • Standby (LPM3 With VLO): 0.4 µA (Typical)
    • Real-Time Clock (RTC) (LPM3.5): 0.35 µA (Typical) (1)
    • Shutdown (LPM4.5): 0.02 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 128KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (64KB in 4 ms)
    • Unified Memory = Program + Data + Storage in One Single Space
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal Direct Memory Access (DMA)
    • RTC With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to 7 Capture/Compare Registers Each
    • 16-Bit and 32-Bit Cyclic Redundancy Checker (CRC16, CRC32)
  • High-Performance Analog
    • Extended Scan Interface (ESI) for Background Water, Heat, and Gas Volume Measurement
    • 16-Channel Analog Comparator
    • 12-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold and up to 16 External Input Channels
    • Integrated LCD Driver With Contrast Control for up to 320 Segments
  • Multifunction Input/Output Ports
    • All P1 to P10 and PJ Pins Support Capacitive Touch Capability Without Need for External Components
    • Accessible Bit-, Byte- and Word-Wise (in Pairs)
    • Edge-Selectable Wakeup From LPM on Ports P1, P2, P3, and P4
    • Programmable Pullup and Pulldown on All Ports
  • Code Security
    • True Random Number Seed for Random Number Generation Algorithm
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI
    • eUSCI_B0 and eUSCI_B1 Support:
      • I2C With Multiple-Slave Addressing
      • SPI
    • Hardware UART and I2C Bootloader (BSL)
  • Flexible Clock System
    • Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
    • Free Professional Development Environments With EnergyTrace++™ Technology
    • Experimenter and Development Kits
  • Family Members
    • Device Comparison Summarizes the Device Variants and Available Packages Types
  • For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide

(1)RTC is clocked by a 3.7-pF crystal.
  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 16-MHz Clock
    • Wide Supply Voltage Range From 3.6 V Down to 1.8 V (Minimum Supply Voltage is Restricted by SVS Levels, See the SVS Specifications)
  • Optimized Ultra-Low-Power Modes
    • Active Mode: Approximately 100 µA/MHz
    • Standby (LPM3 With VLO): 0.4 µA (Typical)
    • Real-Time Clock (RTC) (LPM3.5): 0.35 µA (Typical) (1)
    • Shutdown (LPM4.5): 0.02 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 128KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (64KB in 4 ms)
    • Unified Memory = Program + Data + Storage in One Single Space
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal Direct Memory Access (DMA)
    • RTC With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to 7 Capture/Compare Registers Each
    • 16-Bit and 32-Bit Cyclic Redundancy Checker (CRC16, CRC32)
  • High-Performance Analog
    • Extended Scan Interface (ESI) for Background Water, Heat, and Gas Volume Measurement
    • 16-Channel Analog Comparator
    • 12-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold and up to 16 External Input Channels
    • Integrated LCD Driver With Contrast Control for up to 320 Segments
  • Multifunction Input/Output Ports
    • All P1 to P10 and PJ Pins Support Capacitive Touch Capability Without Need for External Components
    • Accessible Bit-, Byte- and Word-Wise (in Pairs)
    • Edge-Selectable Wakeup From LPM on Ports P1, P2, P3, and P4
    • Programmable Pullup and Pulldown on All Ports
  • Code Security
    • True Random Number Seed for Random Number Generation Algorithm
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI
    • eUSCI_B0 and eUSCI_B1 Support:
      • I2C With Multiple-Slave Addressing
      • SPI
    • Hardware UART and I2C Bootloader (BSL)
  • Flexible Clock System
    • Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
    • Free Professional Development Environments With EnergyTrace++™ Technology
    • Experimenter and Development Kits
  • Family Members
    • Device Comparison Summarizes the Device Variants and Available Packages Types
  • For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide

(1)RTC is clocked by a 3.7-pF crystal.

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The MSP430 ULP FRAM portfolio consists of a diverse set of devices that feature FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, which are optimized to achieve extended battery life in energy-challenged applications.

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The MSP430 ULP FRAM portfolio consists of a diverse set of devices that feature FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, which are optimized to achieve extended battery life in energy-challenged applications.
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Documentación técnica

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* Errata MSP430FR68891 Microcontroller Errata (Rev. AA) PDF | HTML 21 oct 2021
* Data sheet MSP430FR688x(1), MSP430FR588x(1) Mixed-Signal Microcontrollers datasheet (Rev. C) PDF | HTML 29 ago 2018

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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