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MSP430FR6870

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MCU 16 MHz, 32 KB FRAM, 2 KB SRAM, LCD 112 s, 12 bits ADC, comparador, DMA, UART/SPI/I2C, temporiz.

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MSP430FR6870

ACTIVO
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Detalles del producto

CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 32 RAM (kByte) 2 ADC type 12-bit SAR Features DMA, LCD, Real-time clock UART 2 Number of ADC channels 8 SPI 4 USB No Hardware accelerators 0 Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Nonvolatile memory (kByte) 32 Number of GPIOs 51 Number of I2Cs 2 Security Secure debug, Software IP protection
CPU MSP430 Frequency (MHz) 16 Flash memory (kByte) 32 RAM (kByte) 2 ADC type 12-bit SAR Features DMA, LCD, Real-time clock UART 2 Number of ADC channels 8 SPI 4 USB No Hardware accelerators 0 Operating temperature range (°C) -40 to 85 Rating Catalog Communication interface I2C, SPI, UART Operating system BareMetal (No OS), TI RTOS Nonvolatile memory (kByte) 32 Number of GPIOs 51 Number of I2Cs 2 Security Secure debug, Software IP protection
LQFP (PM) 64 144 mm² 12 x 12 VQFN (RGC) 64 81 mm² 9 x 9
  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 16-MHz Clock
    • Wide Supply Voltage Range From 3.6 V Down to 1.8 V (Minimum Supply Voltage is Restricted by SVS Levels, See the SVS Specifications)
  • Optimized Ultra-Low-Power Modes
    • Active Mode: Approximately 100 µA/MHz
    • Standby (LPM3 With VLO): 0.4 µA (Typical)
    • Real-Time Clock (RTC) (LPM3.5): 0.35 µA (Typical) (1)
    • Shutdown (LPM4.5): 0.04 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 64KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (64KB in 4 ms)
    • Unified Memory = Program, Data, and Storage in One Single Space
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal Direct Memory Access (DMA)
    • RTC With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to Seven Capture/Compare Registers
    • 16-Bit and 32-Bit Cyclic Redundancy Checker (CRC16, CRC32)
  • High-Performance Analog
    • Up to 8-Channel Analog Comparator
    • 12-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold and up to 8 External Input Channels
    • Integrated 116-Segment LCD Driver With Contrast Control
  • Code Security and Encryption
    • 128-Bit or 256-Bit AES Security Encryption and Decryption Coprocessor (MSP430FR69xx(1) Only)
    • True Random Number Seed for Random Number Generation Algorithm
    • Lockable Memory Segments for IP Encapsulation and Secure Storage
  • Multifunction Input/Output Ports
    • All I/O Pins Support Capacitive Touch Capability Without Need for External Components
    • Accessible Bit-, Byte- and Word-Wise (in Pairs)
    • Edge-Selectable Wakeup From LPM on Ports P1 to P4
    • Programmable Pullup and Pulldown on All Ports
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI at Rates up to 10 Mbps
    • eUSCI_B0 and eUSCI_B1 Support:
      • I2C With Multiple-Slave Addressing
      • SPI at Rates up to 10 Mbps
  • Flexible Clock System
    • Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
    • Free Professional Development Environments With EnergyTrace++™ Technology for Power Profiling and Debugging
    • Microcontroller Development Boards Available
  • Family Members
    • Device Comparison Summarizes the Available Variants and Packages
  • For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide

(1)The RTC is clocked by a 3.7-pF crystal.
  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 16-MHz Clock
    • Wide Supply Voltage Range From 3.6 V Down to 1.8 V (Minimum Supply Voltage is Restricted by SVS Levels, See the SVS Specifications)
  • Optimized Ultra-Low-Power Modes
    • Active Mode: Approximately 100 µA/MHz
    • Standby (LPM3 With VLO): 0.4 µA (Typical)
    • Real-Time Clock (RTC) (LPM3.5): 0.35 µA (Typical) (1)
    • Shutdown (LPM4.5): 0.04 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 64KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (64KB in 4 ms)
    • Unified Memory = Program, Data, and Storage in One Single Space
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal Direct Memory Access (DMA)
    • RTC With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to Seven Capture/Compare Registers
    • 16-Bit and 32-Bit Cyclic Redundancy Checker (CRC16, CRC32)
  • High-Performance Analog
    • Up to 8-Channel Analog Comparator
    • 12-Bit Analog-to-Digital Converter (ADC) With Internal Reference and Sample-and-Hold and up to 8 External Input Channels
    • Integrated 116-Segment LCD Driver With Contrast Control
  • Code Security and Encryption
    • 128-Bit or 256-Bit AES Security Encryption and Decryption Coprocessor (MSP430FR69xx(1) Only)
    • True Random Number Seed for Random Number Generation Algorithm
    • Lockable Memory Segments for IP Encapsulation and Secure Storage
  • Multifunction Input/Output Ports
    • All I/O Pins Support Capacitive Touch Capability Without Need for External Components
    • Accessible Bit-, Byte- and Word-Wise (in Pairs)
    • Edge-Selectable Wakeup From LPM on Ports P1 to P4
    • Programmable Pullup and Pulldown on All Ports
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI at Rates up to 10 Mbps
    • eUSCI_B0 and eUSCI_B1 Support:
      • I2C With Multiple-Slave Addressing
      • SPI at Rates up to 10 Mbps
  • Flexible Clock System
    • Fixed-Frequency DCO With 10 Selectable Factory-Trimmed Frequencies
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
    • Free Professional Development Environments With EnergyTrace++™ Technology for Power Profiling and Debugging
    • Microcontroller Development Boards Available
  • Family Members
    • Device Comparison Summarizes the Available Variants and Packages
  • For Complete Module Descriptions, See the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide

(1)The RTC is clocked by a 3.7-pF crystal.

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet MSP430FR697x(1), MSP430FR687x(1), MSP430FR692x(1), MSP430FR682x(1) Mixed‑Signal Microcontrollers datasheet (Rev. E) PDF | HTML 30 ago 2018
* Errata MSP430FR6870 Device Erratasheet (Rev. S) 09 oct 2019
* User guide MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P) PDF | HTML 21 abr 2020
Application note Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. B) PDF | HTML 02 jun 2025
Application note ESD Diode Current Specification (Rev. B) PDF | HTML 23 ago 2021
Application note MSP430 FRAM Technology – How To and Best Practices (Rev. B) 12 ago 2021
Application note MSP430 System-Level ESD Considerations (Rev. B) PDF | HTML 14 jul 2021
User guide MSP430 MCUs Development Guide Book (Rev. A) PDF | HTML 13 may 2021
Application note MSP430 System ESD Troubleshooting Guide PDF | HTML 13 dic 2019
White paper Capacitive Touch and MSP Microcontrollers (Rev. A) 27 abr 2017
Application note Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B) 03 nov 2016
Application note Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E) PDF | HTML 03 nov 2016
Application note Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D) 03 nov 2016
Application note General Oversampling of MSP ADCs for Higher Resolution (Rev. A) PDF | HTML 01 abr 2016
Application note Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A) 30 mar 2016
Application note MSP Code Protection Features PDF | HTML 07 dic 2015
Application note Designing With MSP430™ MCUs and Segment LCDs (Rev. A) PDF | HTML 20 jul 2015
Application note Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A) 29 ene 2015
White paper Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers 15 sep 2014
White paper System advantages of mixed signal integration 17 jun 2014
Application note MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology 09 jun 2014
Application note MSP430 FRAM Quality and Reliability (Rev. A) 01 may 2014
White paper FRAM FAQs 23 abr 2014
White paper Benchmarking MCU power consumption for ultra-low-power applications 26 oct 2012

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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