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Texas Instruments has shipped billions of chip scale power MOSFETs that go into a variety of applications and end equipment types. Because of their small size, high performance and proven reliability, customers often favor these devices over conventional, plastic packaged parts. In general, the small percentage of assembly issues discussed below can be avoided by following the recommendations in the documentation referenced in this article.
FemtoFET™ is a trademark of Texas Instruments.
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Texas Instruments manufactures high performance power MOSFETs in chip scale silicon, land grid array (LGA) packages with metalized pads and wafer level chip scale packages (WLCSP) with die-sized ball grid array (DSBGA) interconnect allowing attachment to a printed circuit board (PCB) using standard surface mount technology (SMT) assembly processes. Occasionally, manufacturers have reported problems processing these devices and achieving acceptable results. The article discusses some of the common issues and their recommended solutions. Figure 1-1, Figure 1-2, and Figure 1-3 shows TI LGA and WLCSP MOSFETs.
In 2013, TI introduced P and N-channel MOSFETs in the F4 FemtoFET™ LGA package. Since then, two more packages, F3 and F5, and numerous devices have filled out the FemtoFET™ product portfolio. Additionally, LGA technology has been extended to include single and dual FETs for multiple applications where small size and high performance are advantageous. Figure 2-1 and Figure 2-2 shows illustrations of the F4 and F5 FemtoFET™ devices.
WLCSP is another family of chip scale MOSFETs similar to LGA devices using DSBGA interconnect instead of metalized pads on the chip as shown in Figure 1-3.