CSD25304W1015
-20-V, P channel NexFET™ power MOSFET single WLP 1 mm x 1.5 mm, 32.5 mOhm
Data sheet
CSD25304W1015
- Ultra-Low Qg and Qgd
- Small Footprint
- Low Profile 0.62 mm Height
- Pb Free
- RoHS Compliant
- Halogen Free
- CSP 1 × 1.5 mm Wafer Level Package
This 27 mΩ, 20 V, P-Channel device is designed to deliver the lowest on-resistance and gate charge in a small 1.0 × 1.5 mm outline with excellent thermal characteristics in an ultra-low profile.
Technical documentation
No results found. Please clear your search and try again.
View all 9 Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | CSD25304W1015 20-V P-Channel NexFET Power MOSFET datasheet (Rev. A) | PDF | HTML | 26 Aug 2014 |
Application note | MOSFET Support and Training Tools (Rev. F) | PDF | HTML | 14 Jun 2024 | |
Application note | Semiconductor and IC Package Thermal Metrics (Rev. D) | PDF | HTML | 25 Mar 2024 | |
Application note | Using MOSFET Transient Thermal Impedance Curves In Your Design | PDF | HTML | 18 Dec 2023 | |
Application note | Solving Assembly Issues with Chip Scale Power MOSFETs | PDF | HTML | 14 Dec 2023 | |
Application note | Using MOSFET Safe Operating Area Curves in Your Design | PDF | HTML | 13 Mar 2023 | |
Application brief | Tips for Successfully Paralleling Power MOSFETs | PDF | HTML | 31 May 2022 | |
More literature | WCSP Handling Guide | 07 Nov 2019 | ||
Application note | AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AI) | 14 Jun 2019 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
Support software
Quickly trade off size, cost and performance to select the optimal MOSFET based on application conditions.
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
DSBGA (YZC) | 6 | Ultra Librarian |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Information included:
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.