SLVAFH0 December   2023 CSD13201W10 , CSD13302W , CSD13303W1015 , CSD13306W , CSD13380F3 , CSD13381F4 , CSD13383F4 , CSD13385F5 , CSD15380F3 , CSD17381F4 , CSD17382F4 , CSD17483F4 , CSD17484F4 , CSD17585F5 , CSD18541F5 , CSD22202W15 , CSD22204W , CSD22205L , CSD22206W , CSD23202W10 , CSD23203W , CSD23280F3 , CSD23285F5 , CSD23381F4 , CSD23382F4 , CSD25202W15 , CSD25211W1015 , CSD25213W10 , CSD25304W1015 , CSD25480F3 , CSD25481F4 , CSD25483F4 , CSD25484F4 , CSD25485F5 , CSD25501F3 , CSD75207W15 , CSD75208W1015 , CSD83325L , CSD85302L , CSD86311W1723 , CSD87501L

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Solving Assembly Issues with Chip Scale Power MOSFETs
  5. 2Land Grid Array (LGA) MOSFET Packaging Technology
  6. 3Wafer Level Chip Scale Packaging Technology
  7. 4Common Issues
  8. 5Best Practices
  9. 6Considerations When There are Problems
    1. 6.1 Tilted or Misaligned Packages
    2. 6.2 Solder Balls, Poor, or no Solder
    3. 6.3 Chipped or Cracked Devices
  10. 7Summary
  11. 8References

7 Summary

High performance power MOSFETs in innovative chip scale silicon packages from Texas Instruments fit into many applications where space is at a premium. These LGA and WLCSP devices have gained traction in the market and are being used in multiple end equipment types. This article discussed common issues customers have reported during PCB assembly of these components and provides guidance to identify and correct these problems. For best results, engineers and PCB designers should closely follow the recommended PCB land and stencil recommendations in the MOSFET data sheet and design documents referenced in this article.