Produktdetails

Technology family CD4000 Function Encoder Configuration 8:3 Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog
Technology family CD4000 Function Encoder Configuration 8:3 Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Converts from 1 of 8 to binary
  • Provides cascading feature to handle any number of inputs
  • Group select indicates one or more priority inputs
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range):
         0.5 V at VDD = 5 V
         1.5 V at VDD = 10 V
         1.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications:
    • Priority encoder
    • Binary or BCD encoder (keyboard encoding)
    • Floating point arithmetic

Data sheet acquired from Harris Semiconductor

  • Converts from 1 of 8 to binary
  • Provides cascading feature to handle any number of inputs
  • Group select indicates one or more priority inputs
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range):
         0.5 V at VDD = 5 V
         1.5 V at VDD = 10 V
         1.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications:
    • Priority encoder
    • Binary or BCD encoder (keyboard encoding)
    • Floating point arithmetic

Data sheet acquired from Harris Semiconductor

CD4532B consists of combinational logic that encodes the highest priority input (D7-D0) to a 3-bit binary code. The eight inputs, D7 through D0, each have an assigned priority; D7 is the highest priority and D0 is the lowest. The priority encoder is inhibited when the chip-enable input EI is low. When EI is high, the binary representation of the highest-priority input appears on output lines Q2-Q0, and the group select line GS is high to indicate that priority inputs are present. The enable-out (EO) is high when no priority inputs are present. If any one input is high, EO is low and all cascaded lower-order stages are disabled.

The CD4532B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4532B consists of combinational logic that encodes the highest priority input (D7-D0) to a 3-bit binary code. The eight inputs, D7 through D0, each have an assigned priority; D7 is the highest priority and D0 is the lowest. The priority encoder is inhibited when the chip-enable input EI is low. When EI is high, the binary representation of the highest-priority input appears on output lines Q2-Q0, and the group select line GS is high to indicate that priority inputs are present. The enable-out (EO) is high when no priority inputs are present. If any one input is high, EO is low and all cascaded lower-order stages are disabled.

The CD4532B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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Technische Dokumentation

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Typ Titel Datum
* Data sheet CD4532B TYPES datasheet (Rev. C) 13 Okt 2003
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 Dez 2001

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

14-24-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14-polige bis 24-polige D-, DB-, DGV-, DW-, DYY-, NS-

Das 14-24-LOGIC-EVM-Evaluierungsmodul (EVM) ist für die Unterstützung aller Logikgeräte konzipiert, die sich in einem 14-Pin- bis 24-Pin-D-, DW-, DB-, NS-, PW-, DYY- oder DGV-Gehäuse befinden.

Benutzerhandbuch: PDF | HTML
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
PDIP (N) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
SOP (NS) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian

Bestellen & Qualität

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  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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