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SN74LVC157A-EP

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SN74LVC157A-EP

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Produktdetails

Technology family LVC Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -40 to 125 Rating HiRel Enhanced Product
Technology family LVC Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -40 to 125 Rating HiRel Enhanced Product
SOIC (D) 16 59.4 mm² 9.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Operates From 2 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.4 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
       >2 V at VCC = 3.3 V, TA = 25°C

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Operates From 2 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.4 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
       >2 V at VCC = 3.3 V, TA = 25°C

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74LVC157A-EP quadruple 2-line to 1-line data selector/multiplexer is designed for 2.7-V to 3.6-V VCC operation.

This device features a common strobe (G)\ input. When G\ is high, all outputs are low. When G\ is low, a 4-bit word is selected from one of two sources and is routed to the four outputs. The device provides true data.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.

The SN74LVC157A-EP quadruple 2-line to 1-line data selector/multiplexer is designed for 2.7-V to 3.6-V VCC operation.

This device features a common strobe (G)\ input. When G\ is high, all outputs are low. When G\ is low, a 4-bit word is selected from one of two sources and is routed to the four outputs. The device provides true data.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.
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Technische Dokumentation

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Typ Titel Datum
* Data sheet SN74LVC157A-EP datasheet (Rev. A) 03 Mai 2004
* VID SN74LVC157A-EP VID V6204659 21 Jun 2016
* Radiation & reliability report CLVC157AQPWREP Reliability Report 06 Sep 2013
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dez 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 Mai 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 Mai 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mär 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dez 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dez 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 Mai 1996

Design und Entwicklung

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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
SOIC (D) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian
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Bestellen & Qualität

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  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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  • Werksstandort
  • Montagestandort

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