Produktdetails

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 1.7 CON (typ) (pF) 144 ON-state leakage current (max) (µA) 0.0033 Supply current (typ) (µA) 65 Operating temperature range (°C) -55 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 370 Rating Catalog Drain supply voltage (max) (V) 22 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -22
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 1.7 CON (typ) (pF) 144 ON-state leakage current (max) (µA) 0.0033 Supply current (typ) (µA) 65 Operating temperature range (°C) -55 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 370 Rating Catalog Drain supply voltage (max) (V) 22 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -22
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Latch-up immune
  • Dual supply range: ±4.5V to ±22 V
  • Single supply range: 4.5V to 44 V
  • –55°C to +125°C operating temperature
  • Low on-resistance: 2Ω
  • High current support: 220mA (maximum)
  • 1.8V logic compatible
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional operation
  • Latch-up immune
  • Dual supply range: ±4.5V to ±22 V
  • Single supply range: 4.5V to 44 V
  • –55°C to +125°C operating temperature
  • Low on-resistance: 2Ω
  • High current support: 220mA (maximum)
  • 1.8V logic compatible
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional operation

The TMUX7212M is a complementary metal-oxide semiconductor (CMOS) switch with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5V to 44 V), dual supplies (±4.5V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5V). The TMUX7212M supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.

Each switch of the TMUX7212M is controlled with appropriate logic control inputs on the SELx pins. The TMUX7212M is part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.

The TMUX7212M provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX7212M family of switches and multiplexers to be used in harsh environments. Additionally, the TMUX7212M is rated for extended temperature use down to –55°C, making it an excellent choice for harsh industrial and aerospace applications.

The TMUX7212M is a complementary metal-oxide semiconductor (CMOS) switch with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5V to 44 V), dual supplies (±4.5V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5V). The TMUX7212M supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.

Each switch of the TMUX7212M is controlled with appropriate logic control inputs on the SELx pins. The TMUX7212M is part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.

The TMUX7212M provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX7212M family of switches and multiplexers to be used in harsh environments. Additionally, the TMUX7212M is rated for extended temperature use down to –55°C, making it an excellent choice for harsh industrial and aerospace applications.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 1
Typ Titel Datum
* Data sheet TMUX7212M 44 V , Low-RON, 1:1 (SPST), 4-Channel Precision Switches with Latch-Up Immunity and 1.8-V Logic datasheet PDF | HTML 08 Jan 2024

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

TMUX721XEVM — TMUX721x im PW-Gehäuse – Evaluierungsmodul

Der TMUX721xEVM unterstützt die Evaluierung von TMUX721x-Bausteinen im 16-poligen TSSOP (PW)-Gehäuse, einschließlich TMUX7211PWR, TMUX7212PWR und TMUX7213PWR. Dieses Evaluierungsmodul kann für schnelles Prototyping und Prüfen der TMUX721x-Bausteine verwendet werden, insbesondere für DC- und (...)

Benutzerhandbuch: PDF
Schnittstellenadapter

LEADED-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zur schnellen Prüfung der 5-, 8-, 10-, 16- und 24-poligen

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Benutzerhandbuch: PDF
Schnittstellenadapter

LEADLESS-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zum Testen der 6-, 8-, 10-, 12-, 14-, 16- und 20-poligen

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Benutzerhandbuch: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
TSSOP (PW) 16 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos