Produktdetails

Rating Catalog Operating temperature range (°C) -40 to 85
Rating Catalog Operating temperature range (°C) -40 to 85
VQFN (RGZ) 48 49 mm² 7 x 7
  • Frequency Range: 1.7-2.0 GHz
  • Integrated Baseband Programmable Gain Amplifier
  • On Chip Programmable Baseband Filter
  • High Cascaded IP3: 21 dBm at 1.9 GHz
  • High IP2: 60 dBm at 1.9 GHz
  • Hardware and Software Power Down
  • 3-Wire Serial Programmable Interface
  • Single Supply: 4.5 V to 5.5 V Operation
  • APPLICATIONS
    • Wireless Infrastructure
      • WCDMA
      • CDMA
    • Wireless Local Loop
    • High Linearity Direct-Down Conversion Receiver

All trademarks are the property of their respective owners.

  • Frequency Range: 1.7-2.0 GHz
  • Integrated Baseband Programmable Gain Amplifier
  • On Chip Programmable Baseband Filter
  • High Cascaded IP3: 21 dBm at 1.9 GHz
  • High IP2: 60 dBm at 1.9 GHz
  • Hardware and Software Power Down
  • 3-Wire Serial Programmable Interface
  • Single Supply: 4.5 V to 5.5 V Operation
  • APPLICATIONS
    • Wireless Infrastructure
      • WCDMA
      • CDMA
    • Wireless Local Loop
    • High Linearity Direct-Down Conversion Receiver

All trademarks are the property of their respective owners.

The TRF3710 is a highly linear and integrated direct-conversion quadrature demodulator optimized for Third-Generation (3G) wireless infrastructure. The TRF3710 integrates balanced I and Q mixers, LO buffers and phase splitters to convert an RF signal directly to I and Q baseband. The on-chip programmable-gain amplifiers allow adjustment of the output signal level without the need for external variable-gain (attenuator) devices. The TRF3710 integrates programmable baseband low-pass filters that attenuate nearby interference, eliminating the need for an external baseband filter.

Housed in a 7X7mm QFN package, the TRF3710 provides the smallest and most integrated receiver solution available for high performance equipment.

The TRF3710 is a highly linear and integrated direct-conversion quadrature demodulator optimized for Third-Generation (3G) wireless infrastructure. The TRF3710 integrates balanced I and Q mixers, LO buffers and phase splitters to convert an RF signal directly to I and Q baseband. The on-chip programmable-gain amplifiers allow adjustment of the output signal level without the need for external variable-gain (attenuator) devices. The TRF3710 integrates programmable baseband low-pass filters that attenuate nearby interference, eliminating the need for an external baseband filter.

Housed in a 7X7mm QFN package, the TRF3710 provides the smallest and most integrated receiver solution available for high performance equipment.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 9
Typ Titel Datum
* Data sheet IQ Demodulator datasheet (Rev. A) 18 Feb 2008
Technical article Can a clock generator act as a jitter cleaner? PDF | HTML 23 Mär 2017
Technical article Don’t let bad reference signals destroy the phase noise in your PLL/synthesizer PDF | HTML 10 Jan 2017
Technical article A survival guide to scaling your PLL loop filter design PDF | HTML 22 Nov 2016
User guide TSW6011EVM Quick Start Guide (Rev. D) 17 Aug 2016
Technical article What to do when your PLL does not lock PDF | HTML 12 Jul 2016
Technical article Issues with jitter, phase noise, lock time or spurs? Check the loop-filter bandwid PDF | HTML 06 Jun 2016
Application note DC Offset Auto-Calibration of TRF371x 05 Nov 2009
EVM User's guide TRF3710EVM 16 Jul 2007

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Schaltplan

TRF3710/TRF3711 Reference Designs

SLWR033.ZIP (1195 KB)
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RGZ) 48 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos