Detalles del producto

Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Fully integrated solution for ultrasonic sensing
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
  • Fully integrated solution for ultrasonic sensing
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics

The PGA460 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

The PGA460 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

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Documentación técnica

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Tipo Título Fecha
* Data sheet PGA460 Ultrasonic Signal Processor and Transducer Driver datasheet (Rev. C) PDF | HTML 10 feb 2023
Application note PGA460 Control Based on MSPM0 for Distance Detection PDF | HTML 17 abr 2024
Application brief Hall-Effect Sensors in Vacuum Robots PDF | HTML 22 mar 2022
Application note Ultrasonic Sensing Basics (Rev. D) PDF | HTML 02 dic 2021
Application note PGA460 Ultrasonic Module Hardware and Software Optimization (Rev. A) PDF | HTML 07 abr 2021
Application brief Ultrasonic Sensing in Automated Terrain-Type and Obstacle Detection in Robotic (Rev. B) PDF | HTML 03 ene 2021
E-book E-book: An engineer’s guide to industrial robot designs 12 feb 2020
Technical article How to choose the right proximity sensor for your design needs PDF | HTML 31 oct 2019
Application brief Using Ultrasonic Technology for Smart Parking and Garage Gate Systems 08 ago 2019
Application note How to select the right proximity sensor technology 19 jul 2019
EVM User's guide PGA460PSM-EVM User's Guide 15 jul 2019
Application brief Ultrasonic Floor-Type and Cliff Detection on Automated Vacuum Robots 15 jul 2019
Application note PGA460 Array of Ultrasonic Transducers for Triangulation and Tracking 12 jul 2019
Technical article Paving the way with ultrasonic sensing PDF | HTML 10 jun 2019
Application note PGA460 Full-Bridge Driver Solutions for Ultrasonic Transducers (Rev. A) 28 feb 2019
Design guide Ultrasonic Proximity-Sensing Module (PSM) Reference Design 09 oct 2018
User guide PGA460-Q1 Ultrasonic Signal Conditioner EVM With Transducer User's Guide (Rev. B) 19 mar 2018
Technical article Where are ultrasonic sensors used? – Part 2 PDF | HTML 31 oct 2017
Technical article How ultrasonic technology improves convenience and performance in home automation PDF | HTML 05 oct 2017
Application note PGA460 Software Development Guide (Rev. A) 22 ago 2017
Technical article Where are ultrasonic sensors used? – Part 1 PDF | HTML 29 jun 2017
Application note PGA460 Frequently Asked Questions (FAQ) and EVM Troubleshooting Guide 01 may 2017
User guide PGA460-Q1 EVM Quick Start Guide 17 feb 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

BOOSTXL-PGA460 — Módulo de evaluación de acondicionamiento de señal PGA460-Q1 de sensores ultrasónicos con transducto

Fully evaluate the PGA460 ultrasonic sensor signal conditioner with the BOOSTXL-PGA460 (+ MSP430F5529LP). The PGA460 is an integrated ultrasonic front-end with a digital signal processor that outputs time-of-flight data, echo width and amplitude information. The driver strength is configurable by a (...)
Guía del usuario: PDF
Placa de evaluación

PGA460PSM-EVM — PGA460 Módulo de evaluación de sensores ultrasónicos de proximidad

For shipments to Europe, please order the equivalent signal conditioning device BOOSTXL-PGA460

The PGA460PSM evaluation module (EVM) is a small-form-factor solution showcasing double-sided printed circuit board (PCB) spacing and the supporting component requirements for the PGA460 ultrasonic (...)

Guía del usuario: PDF
Ejemplo de código o demostración

SLAC741 PGA460 Energia Library and Code Example (Version 1.1.0)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
AFE sensores ultrasónicos
PGA460 Procesador de señal ultrasónica y controlador de transductor PGA460-Q1 Procesador de señal ultrasónica y controlador de transductor para sector automotriz
Desarrollo de hardware
Placa de evaluación
BOOSTXL-PGA460 Módulo de evaluación de acondicionamiento de señal PGA460-Q1 de sensores ultrasónicos con transducto PGA460PSM-EVM PGA460 Módulo de evaluación de sensores ultrasónicos de proximidad
GUI para el módulo de evaluación (EVM)

SLAC739 PGA460-Q1 EVM GUI (Version 1.0.2.0)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
AFE sensores ultrasónicos
PGA460 Procesador de señal ultrasónica y controlador de transductor PGA460-Q1 Procesador de señal ultrasónica y controlador de transductor para sector automotriz
Desarrollo de hardware
Placa de evaluación
BOOSTXL-PGA460 Módulo de evaluación de acondicionamiento de señal PGA460-Q1 de sensores ultrasónicos con transducto PGA460PSM-EVM PGA460 Módulo de evaluación de sensores ultrasónicos de proximidad
Enchufe

SIMPLELINK-SDK-SENSOR-ACTUATOR-PLUGIN Sensor and Actuator Plug-in for SimpleLink™ MCU SDKs

The Sensor and Actuator Plugin for SimpleLink™ MCU SDKs provides support for a variety of related components including optical and temperature and humidity sensors, allowing customers to easily add new features to their SimpleLink MCU-based design. API user guides are provided for each (...)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Sensores de temperatura digitales
TMP116 Sensor de temperatura digital de 0.2 °C con memoria no volátil de 64 bits
AFE sensores ultrasónicos
PGA460 Procesador de señal ultrasónica y controlador de transductor
Productos Wi-Fi
CC3220MODA Módulo inalámbrico con antena para SimpleLink™ Arm Cortex-M4 de 32 bits Wi-Fi® CC3220R MCU inalámbrico Wi-Fi® SimpleLink™ Arm Cortex-M4 de 32 bits con 6 TLS/SSL y RAM de 256 kB CC3220S MCU inalámbrico Wi-Fi® SimpleLink™ Arm Cortex-M4 de 32 bits con arranque seguro y RAM de 256 kB CC3220SF MCU inalámbrico Wi-Fi® SimpleLink™ Arm Cortex-M4 de 32 bits con 1 MB de memoria flash y RAM de 256 k
Sensores lineales de efecto Hall
DRV5055 Sensor de efecto Hall radiométrico, lineal con salida analógica
Sensores de humedad
HDC2010 Sensor digital ultrapequeño de humedad relativa de baja potencia y RH del 2 % HDC2080 Sensor digital de humedad relativa de potencia ultrabaja y RH del 2 % con interrupción/DRDY
ADC de precisión
ADS7142-Q1 ADC de 2 canales, 12 bits y 140 kSPS compatible con I2C para automoción con umbral programable y act
Productos de 2.4 GHz de baja potencia
CC2640R2F MCU inalámbrico de 32 bits SimpleLink™ Arm® Cortex®-M3 Bluetooth® 5.1 de baja energía con Flash de 1
Sensores de luz ambiental
OPT3001 Sensor digital de luz ambiental (ALS) con respuesta de alta precisión para el ojo humano
Desarrollo de hardware
Placa de evaluación
BOOSTXL-ADS7142-Q1 Módulo enchufable ADC BoosterPack™ compatible con I2C de 12 bits, 140 kSPS y 2 canales ADS7142-Q1 BOOSTXL-BASSENSORS Módulo complementario para sensores BoosterPack para automatización de edificios BOOSTXL-PGA460 Módulo de evaluación de acondicionamiento de señal PGA460-Q1 de sensores ultrasónicos con transducto LAUNCHXL-CC1310 Kit de desarrollo de LaunchPad MCU inalámbrico CC1310 SimpleLink™ Sub 1 GHz LAUNCHXL-CC2640R2 Kit de desarrollo de LaunchPad™ de MCU inalámbrico CC2640R2 SimpleLink™ Bluetooth® de baja energía LAUNCHXL-CC26X2R1 Kit de desarrollo CC26x2R LaunchPad™ para MCU inalámbrica multiestándar SimpleLin
Kit de desarrollo
CC3220S-LAUNCHXL Kit de desarrollo SimpleLink™, Wi-Fi microcontrolador inalámbrico CC3220S LaunchPad™ CC3220SF-LAUNCHXL Kit de desarrollo para Microcontrolador inalámbrico LaunchPad™ CC3220SF de SimpleLink™ Wi-Fi® LAUNCHXL-CC1352R1 Kit de desarrollo de LaunchPad™ de MCU inalámbrico CC1352R SimpleLink™ multibanda MSP-EXP432E401Y Kit de desarrollo LaunchPad™ MCU SimpleLink™ Ethernet MSP432E401Y
Opciones de descarga
Modelo de simulación

PGA460 IBIS Model

SLAM301.ZIP (65 KB) - IBIS Model
Archivo Gerber

PGA460 Transducer and Transformer Listing

SLAC787.ZIP (21 KB)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Diseños de referencia

TIDA-060024 — Diseño de referencia de módulo de detección de proximidad (PSM) ultrasónica

This reference design is a small-form factor solution showcasing double-sided PCB spacing and minimum supporting component requirements for the PGA460 ultrasonic sensor signal conditioner. This module operates in a mono-static mode for single sensor transmit and receive operation to enable object (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-01386 — Diseño de referencia del sensor de distancia ultrasónico con IO-Link

This reference design features an ultrasonic distance sensor that fits in a M12 housing due to its high integration and an optimized layout. The design offers an IO-Link interface to communicate with the system control, which makes it industry 4.0 ready.  The purpose of ultrasonic (...)
Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
TSSOP (PW) 16 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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