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PGA460-Q1

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Procesador de señal ultrasónica y controlador de transductor para sector automotriz

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PGA460-Q1

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Detalles del producto

Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.
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Documentación técnica

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* Data sheet PGA460-Q1 Automotive Ultrasonic Signal Processor and Transducer Driver datasheet (Rev. C) PDF | HTML 10 feb 2023
White paper Automated parking made possible with TI mmWave radar and ultrasonic sensors (Rev. B) 23 jun 2023
Application note Ultrasonic Sensing Basics (Rev. D) PDF | HTML 02 dic 2021
Application note PGA460 Ultrasonic Module Hardware and Software Optimization (Rev. A) PDF | HTML 07 abr 2021
EVM User's guide PGA460PSM-EVM User's Guide 15 jul 2019
Application brief Ultrasonic Floor-Type and Cliff Detection on Automated Vacuum Robots 15 jul 2019
Application note PGA460 Array of Ultrasonic Transducers for Triangulation and Tracking 12 jul 2019
Technical article Paving the way with ultrasonic sensing PDF | HTML 10 jun 2019
Application note PGA460 Full-Bridge Driver Solutions for Ultrasonic Transducers (Rev. A) 28 feb 2019
Design guide Ultrasonic Proximity-Sensing Module (PSM) Reference Design 09 oct 2018
User guide PGA460-Q1 Ultrasonic Signal Conditioner EVM With Transducer User's Guide (Rev. B) 19 mar 2018
Application brief PGA460-Q1 in Automotive Ultrasonic Kick-to-open Liftgate Systems (Rev. B) 03 ene 2018
Application brief PGA460-Q1 in Ultrasonic Park Assist (UPA) (Rev. A) 03 ene 2018
Technical article Where are ultrasonic sensors used? – Part 2 PDF | HTML 31 oct 2017
Technical article Comparing capacitive and ultrasonic kick-to-open sensing PDF | HTML 06 sep 2017
Application note PGA460 Software Development Guide (Rev. A) 22 ago 2017
Technical article Where are ultrasonic sensors used? – Part 1 PDF | HTML 29 jun 2017
Application note PGA460 Frequently Asked Questions (FAQ) and EVM Troubleshooting Guide 01 may 2017
User guide PGA460-Q1 EVM Quick Start Guide 17 feb 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

BOOSTXL-PGA460 — Módulo de evaluación de acondicionamiento de señal PGA460-Q1 de sensores ultrasónicos con transducto

Fully evaluate the PGA460 ultrasonic sensor signal conditioner with the BOOSTXL-PGA460 (+ MSP430F5529LP). The PGA460 is an integrated ultrasonic front-end with a digital signal processor that outputs time-of-flight data, echo width and amplitude information. The driver strength is configurable by a (...)
Guía del usuario: PDF
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Placa de evaluación

PGA460PSM-EVM — PGA460 Módulo de evaluación de sensores ultrasónicos de proximidad

For shipments to Europe, please order the equivalent signal conditioning device BOOSTXL-PGA460

The PGA460PSM evaluation module (EVM) is a small-form-factor solution showcasing double-sided printed circuit board (PCB) spacing and the supporting component requirements for the PGA460 ultrasonic (...)

Guía del usuario: PDF
No disponible en TI.com
Ejemplo de código o demostración

SLAC741 — PGA460 Energia Library and Code Example (Version 1.1.0)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
AFE sensores ultrasónicos
PGA460 — Procesador de señal ultrasónica y controlador de transductor PGA460-Q1 — Procesador de señal ultrasónica y controlador de transductor para sector automotriz
Desarrollo de hardware
Placa de evaluación
BOOSTXL-PGA460 — Módulo de evaluación de acondicionamiento de señal PGA460-Q1 de sensores ultrasónicos con transducto PGA460PSM-EVM — PGA460 Módulo de evaluación de sensores ultrasónicos de proximidad
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GUI para el módulo de evaluación (EVM)

SLAC739 — PGA460-Q1 EVM GUI (Version 1.0.2.0)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
AFE sensores ultrasónicos
PGA460 — Procesador de señal ultrasónica y controlador de transductor PGA460-Q1 — Procesador de señal ultrasónica y controlador de transductor para sector automotriz
Desarrollo de hardware
Placa de evaluación
BOOSTXL-PGA460 — Módulo de evaluación de acondicionamiento de señal PGA460-Q1 de sensores ultrasónicos con transducto PGA460PSM-EVM — PGA460 Módulo de evaluación de sensores ultrasónicos de proximidad
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Modelo de simulación

PGA460 IBIS Model

SLAM301.ZIP (65 KB) - IBIS Model
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Archivo Gerber

PGA460 Mono-static Transducer Transformer Driver Small Form Factor Design File

SLAC754.ZIP (3274 KB)
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Archivo Gerber

PGA460 Mono-static Transducer Half-Bridge Driver Small Form Factor Design File

SLAC755.ZIP (3279 KB)
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Archivo Gerber

PGA460 Mono-static Transducer Full-Bridge Driver Small Form Factor Design File

SLAC756.ZIP (2665 KB)
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Archivo Gerber

PGA460 Mono-static Transducer Transformer Driver Ultra-Small Design File

SLAC757.ZIP (2470 KB)
Descargar
Archivo Gerber

PGA460 Mono-Static Transducer Half-Bridge Driver Ultra-Small Design File

SLAC758.ZIP (2090 KB)
Descargar
Archivo Gerber

PGA460 Bi-static Transducer Transformer Driver Small Form Factor Design File

SLAC759.ZIP (3279 KB)
Descargar
Archivo Gerber

PGA460 Bi-static Transducer Half-Bridge Driver Small Form Factor Design File

SLAC760.ZIP (3371 KB)
Descargar
Archivo Gerber

PGA460 Bi-static Transducer Full-Bridge Driver Small Form Factor Design File

SLAC761.ZIP (2751 KB)
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Archivo Gerber

PGA460 Transducer and Transformer Listing

SLAC787.ZIP (21 KB)
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Diseños de referencia

TIDA-01424 — Diseño de referencia ultrasónico automotor para abrir

This reference design uses ultrasonic sensing to detect a kicking motion indicating the user's desire to activate a power lift-gate, power trunk, or power sliding door on an automobile.  Ultrasonic sensing allows detection of more than one object, and gives a measure of distance to each (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-01597 — Diseño de referencia de módulo de detección ultrasónica para automoción para asistencia al estaciona

This reference design provides hardware architecture for a Park Assist System (PAS) using three highly integrated, system-on-chip (SoC) ultrasonic transducer drivers. These ultrasonic transducer drivers have an integrated signal conditioner with an advanced digital signal processor (DSP) core. (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-060024 — Diseño de referencia de módulo de detección de proximidad (PSM) ultrasónica

This reference design is a small-form factor solution showcasing double-sided PCB spacing and minimum supporting component requirements for the PGA460 ultrasonic sensor signal conditioner. This module operates in a mono-static mode for single sensor transmit and receive operation to enable object (...)
Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
TSSOP (PW) 16 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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