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The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amps with Shutdown datasheet (Rev. E) | 03 jul 2007 | |
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 28 mar 2017 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
El kit de desarrollo del rendimiento (PDK) del amplificador es un kit de módulo de evaluación (EVM) para probar los parámetros comunes del amplificador operacional y es compatible con la mayoría de los amplificadores operacionales y comparadores. El kit del EVM ofrece una placa principal con varias (...)
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
The DIYAMP-EVM is a unique evaluation module (EVM) family that provides engineers and do it yourselfers (DIYers) with real-world amplifier circuits, enabling you to quickly evaluate design concepts and verify simulations. It is available in three industry-standard packages (SC70, SOT23, SOIC) and (...)
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| PDIP (P) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |
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