Detalles del producto

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Rating Catalog Operating temperature range (°C) to
LQFP (PZ) 100 256 mm² 16 x 16
  • Powerful 16-Bit TMS320C5x CPU
  • 20-, 25-, 35-, and 50-ns Single-Cycle Instruction Execution Time for 5-V Operation
  • 25-, 40-, and 50-ns Single-Cycle Instruction Execution Time for 3-V Operation
  • Single-Cycle 16 × 16-Bit Multiply/Add
  • 224K × 16-Bit Maximum Addressable External Memory Space (64K Program, 64K Data, 64K I/O, and 32K Global)
  • 2K, 4K, 8K, 16K, 32K × 16-Bit Single-Access On-Chip Program ROM
  • 1K, 3K, 6K, 9K × 16-Bit Single-Access On-Chip Program/ Data RAM (SARAM)
  • 1K Dual-Access On-Chip Program/ Data RAM (DARAM)
  • Full-Duplex Synchronous Serial Port for Coder/Decoder Interface
  • Time-Division-Multiplexed (TDM) Serial Port
  • Hardware or Software Wait-State Generation Capability
  • On-Chip Timer for Control Operations
  • Repeat Instructions for Efficient Use of Program Space
  • Buffered Serial Port
  • Host Port Interface
  • Multiple Phase-Locked Loop (PLL) Clocking Options (×1, ×2, ×3, ×4, ×5, ×9 Depending on Device)
  • Block Moves for Data/Program Management
  • On-Chip Scan-Based Emulation Logic
  • Boundary Scan
  • Five Packaging Options
    • 100-Pin Quad Flat Package (PJ Suffix)
    • 100-Pin Thin Quad Flat Package (PZ Suffix)
    • 128-Pin Thin Quad Flat Package (PBK Suffix)
    • 132-Pin Quad Flat Package (PQ Suffix)
    • 144-Pin Thin Quad Flat Package (PGE Suffix)
  • Low Power Dissipation and Power-Down Modes:
    • 47 mA (2.35 mA/ MIP) at 5 V, 40-MHz Clock (Average)
    • 23 mA (1.15 mA/ MIP) at 3 V, 40-MHz Clock (Average)
    • 10 mA at 5 V, 40-MHz Clock (IDLE1 Mode)
    • 3 mA at 5 V, 40-MHz Clock (IDLE2 Mode)
    • 5 mA at 5 V, Clocks Off (IDLE2 Mode)
  • High-Performance Static CMOS Technology
  • IEEE Standard 1149.1 Test-Access Port (JTAG)

TI is a trademark of Texas Instruments Incorporated.
IEEE Standard 1149.1\x961990, IEEE Standard Test-Access Port and Boundary-Scan Architecture.
References to 'C5x in this document include both TMS320C5x and TMS320LC5x devices unless specified otherwise.

  • Powerful 16-Bit TMS320C5x CPU
  • 20-, 25-, 35-, and 50-ns Single-Cycle Instruction Execution Time for 5-V Operation
  • 25-, 40-, and 50-ns Single-Cycle Instruction Execution Time for 3-V Operation
  • Single-Cycle 16 × 16-Bit Multiply/Add
  • 224K × 16-Bit Maximum Addressable External Memory Space (64K Program, 64K Data, 64K I/O, and 32K Global)
  • 2K, 4K, 8K, 16K, 32K × 16-Bit Single-Access On-Chip Program ROM
  • 1K, 3K, 6K, 9K × 16-Bit Single-Access On-Chip Program/ Data RAM (SARAM)
  • 1K Dual-Access On-Chip Program/ Data RAM (DARAM)
  • Full-Duplex Synchronous Serial Port for Coder/Decoder Interface
  • Time-Division-Multiplexed (TDM) Serial Port
  • Hardware or Software Wait-State Generation Capability
  • On-Chip Timer for Control Operations
  • Repeat Instructions for Efficient Use of Program Space
  • Buffered Serial Port
  • Host Port Interface
  • Multiple Phase-Locked Loop (PLL) Clocking Options (×1, ×2, ×3, ×4, ×5, ×9 Depending on Device)
  • Block Moves for Data/Program Management
  • On-Chip Scan-Based Emulation Logic
  • Boundary Scan
  • Five Packaging Options
    • 100-Pin Quad Flat Package (PJ Suffix)
    • 100-Pin Thin Quad Flat Package (PZ Suffix)
    • 128-Pin Thin Quad Flat Package (PBK Suffix)
    • 132-Pin Quad Flat Package (PQ Suffix)
    • 144-Pin Thin Quad Flat Package (PGE Suffix)
  • Low Power Dissipation and Power-Down Modes:
    • 47 mA (2.35 mA/ MIP) at 5 V, 40-MHz Clock (Average)
    • 23 mA (1.15 mA/ MIP) at 3 V, 40-MHz Clock (Average)
    • 10 mA at 5 V, 40-MHz Clock (IDLE1 Mode)
    • 3 mA at 5 V, 40-MHz Clock (IDLE2 Mode)
    • 5 mA at 5 V, Clocks Off (IDLE2 Mode)
  • High-Performance Static CMOS Technology
  • IEEE Standard 1149.1 Test-Access Port (JTAG)

TI is a trademark of Texas Instruments Incorporated.
IEEE Standard 1149.1\x961990, IEEE Standard Test-Access Port and Boundary-Scan Architecture.
References to 'C5x in this document include both TMS320C5x and TMS320LC5x devices unless specified otherwise.

The TMS320C5x generation of the Texas Instruments (TI™) TMS320 digital signal processors (DSPs) is fabricated with static CMOS integrated circuit technology; the architectural design is based upon that of an earlier TI DSP, the TMS320C25. The combination of advanced Harvard architecture, on-chip peripherals, on-chip memory, and a highly specialized instruction set is the basis of the operational flexibility and speed of the 'C5x devices. They execute up to 50 million instructions per second (MIPS).

The 'C5x devices offer these advantages:

  • Enhanced TMS320 architectural design for increased performance and versatility
  • Modular architectural design for fast development of spin-off devices
  • Advanced integrated-circuit processing technology for increased performance
  • Upward-compatible source code (source code for 'C1x and 'C2x DSPs is upward compatible with 'C5x DSPs.)
  • Enhanced TMS320 instruction set for faster algorithms and for optimized high-level language operation
  • New static-design techniques for minimizing power consumption and maximizing radiation tolerance
  • Table 1 provides a comparison of the devices in the 'C5x generation. It shows the capacity of on-chip RAM and ROM memories, number of serial and parallel I/O ports, execution time of one machine cycle, and type of package with total pin count.

    The TMS320C5x generation of the Texas Instruments (TI™) TMS320 digital signal processors (DSPs) is fabricated with static CMOS integrated circuit technology; the architectural design is based upon that of an earlier TI DSP, the TMS320C25. The combination of advanced Harvard architecture, on-chip peripherals, on-chip memory, and a highly specialized instruction set is the basis of the operational flexibility and speed of the 'C5x devices. They execute up to 50 million instructions per second (MIPS).

    The 'C5x devices offer these advantages:

  • Enhanced TMS320 architectural design for increased performance and versatility
  • Modular architectural design for fast development of spin-off devices
  • Advanced integrated-circuit processing technology for increased performance
  • Upward-compatible source code (source code for 'C1x and 'C2x DSPs is upward compatible with 'C5x DSPs.)
  • Enhanced TMS320 instruction set for faster algorithms and for optimized high-level language operation
  • New static-design techniques for minimizing power consumption and maximizing radiation tolerance
  • Table 1 provides a comparison of the devices in the 'C5x generation. It shows the capacity of on-chip RAM and ROM memories, number of serial and parallel I/O ports, execution time of one machine cycle, and type of package with total pin count.

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    Documentación técnica

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    Tipo Título Fecha
    * Data sheet Digital Signal Processors datasheet (Rev. A) 01 abr 1996
    User guide TMS320C5x Evaluation Module Installation Guide (Rev. C) 01 sep 1996
    Application note Improving 32-Channel DTMF Decoders in PBX Systems Using the TMS320C5x DSP 01 jun 1996
    User guide TMS320C5x DSP Starter Kit User's Guide (Rev. A) 01 jun 1996
    Application note Use of the TMS320C5x Internal Oscillator With External Crystals or Resonators 01 jul 1995
    Application note A PCMCIA TMS320 DSP MediaCard for Sound and Fax/Modem Applications 01 mar 1995
    User guide TMS320C5x Emulator Installation Guide (Rev. B) 01 dic 1994
    Application note Setting Up TMS320 DSP Interrupts in 'C' 01 nov 1994
    Application note Minimizing Quantization Effects Using the TMS320 DSP Family 01 jul 1994
    Application note Telecommunications Applications With the TMS320C5x 01 mar 1994
    User guide TMS320C5x C Source Debugger User's Guide (Rev. B) 01 feb 1994
    Application note Calculation Of TMS320C5x Power Dissipation 01 abr 1993
    User guide Parallel Debug Mgr Addendum to TMS320C4x & TMS320C5x C Source Debugger UGs 01 abr 1993

    Diseño y desarrollo

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    Encapsulado Pines Símbolos CAD, huellas y modelos 3D
    LQFP (PZ) 100 Ultra Librarian

    Pedidos y calidad

    Información incluida:
    • RoHS
    • REACH
    • Marcado del dispositivo
    • Acabado de plomo/material de la bola
    • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
    • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
    • Contenido del material
    • Resumen de calificaciones
    • Monitoreo continuo de confiabilidad
    Información incluida:
    • Lugar de fabricación
    • Lugar de ensamblaje

    Soporte y capacitación

    Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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