製品詳細

Rating Military Operating temperature range (°C) -55 to 125
Rating Military Operating temperature range (°C) -55 to 125
CDIP (JT) 24 221.44 mm² 32 x 6.92 LCCC (FD) 28 130.6449 mm² 11.43 x 11.43 LCCC (FK) 28 130.6449 mm² 11.43 x 11.43
  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

ダウンロード 字幕付きのビデオを表示 ビデオ

技術資料

star =TI が選定したこの製品の主要ドキュメント
結果が見つかりませんでした。検索条件をクリアしてから、再度検索を試してください。
1 をすべて表示
種類 タイトル 最新の英語版をダウンロード 日付
* データシート HighPerformance Impact Programmable Array Logic Circuits データシート (Rev. A) 2011年 1月 5日

設計および開発

その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。

パッケージ ピン数 CAD シンボル、フットプリント、および 3D モデル
CDIP (JT) 24 Ultra Librarian
LCCC (FD) 28 Ultra Librarian
LCCC (FK) 28 Ultra Librarian

購入と品質

記載されている情報:
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 使用原材料
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
記載されている情報:
  • ファブの拠点
  • 組み立てを実施した拠点

サポートとトレーニング

TI E2E™ フォーラムでは、TI のエンジニアからの技術サポートを提供

コンテンツは、TI 投稿者やコミュニティ投稿者によって「現状のまま」提供されるもので、TI による仕様の追加を意図するものではありません。使用条件をご確認ください。

TI 製品の品質、パッケージ、ご注文に関するお問い合わせは、TI サポートをご覧ください。​​​​​​​​​​​​​​

ビデオ