CD54AC74

現行

具有設定和重設功能的雙路正緣觸發 D 型正反器

產品詳細資料

Number of channels 2 Technology family AC Supply voltage (min) (V) 1.5 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 110 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 80 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 2 Technology family AC Supply voltage (min) (V) 1.5 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 110 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 80 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 14 130.4652 mm² 19.56 x 6.67
  • AC types feature 1.5V to 5.5V operation and balanced noise immunity at 30% of the supply
  • Speed of bipolar F, AS, and S, with significantly reduced power consumption
  • Balanced propagation delays
  • ±24mA output drive current – fanout to 15 F devices
  • SCR-latchup-resistant CMOS process and circuit design
  • AC types feature 1.5V to 5.5V operation and balanced noise immunity at 30% of the supply
  • Speed of bipolar F, AS, and S, with significantly reduced power consumption
  • Balanced propagation delays
  • ±24mA output drive current – fanout to 15 F devices
  • SCR-latchup-resistant CMOS process and circuit design

The ’AC74 dual positive-edge-triggered devices are D-type flip-flops.

The ’AC74 dual positive-edge-triggered devices are D-type flip-flops.

下載

您可能會感興趣的類似產品

open-in-new 比較替代產品
功能相同,但引腳輸出與所比較的裝置不同
SN74LV2T74-EP 現行 具有清晰、預設和整合式位準移位器的強化型產品雙 D 型正反器 Voltage range (1.65V to 5.5V), voltage translation capable

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 1
類型 標題 日期
* Data sheet CDx4AC74 Dual Positive-Edge-Triggered D-Type Flip-Flops With Clear And Preset datasheet (Rev. E) PDF | HTML 2024年 8月 2日

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​